Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced the appointment of Mary Puma to its board of directors.
Semiconductors
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
Applied Materials Appoints Florent Ducrot as Head of European Operations
Applied Materials, Inc. today announced Florent Ducrot, Vice President and General Manager, to serve as the Head of European Operations.
ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center
ACM Research, Inc. today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period.
Applied Ventures and ITIC Taiwan Joins Series B Funding For Wise-integration’s ‘Disruptive’ Technology
Wise-integration today announced that the investment fund, Applied Ventures-ITIC Innovation Fund (AVITIC), joined the company’s Series B funding round.
How Semiconductor Technologies are Enabling the Next Wave of Augmented Reality
The rapid advancement of Augmented Reality (AR) technology is pushing the boundaries of how we interact with digital information and the physical world
A New Advancement in Photonic Chips Set to Unlock an Industry
Researchers from TMOS, the ARC Centre of Excellence for Transformative Meta-Optical Systems, have developed a new engineering approach to on-chip light sources that could lead to widespread adoption of photonic chips in consumer electronics.
VIS and NXP Announce Establishment of VSMC Joint Venture
Vanguard International Semiconductor Corporation and NXP Semiconductors N.V. today announced that they have obtained all necessary approvals from relevant authorities and injected capital to officially establish the VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) joint venture.
