Two of the electronics industry’s most far-sighted and innovative leaders have been named to the U.S. Department of Commerce’s new Industrial Advisory Committee (IAC), which will provide guidance to the Secretary of Commerce on a range of issues related to CHIPS for America Act programs.
Semiconductors
Innovations in Pressure Regulators Support Yield Optimization in Semiconductor Manufacturing
Embracing and integrating new component-level technologies is a way to measurably improve quality, safety and yield.
U.S. Dept. of Commerce Appoints First Members to Industrial Advisory Committee
The U.S. Department of Commerce announced the appointment of 24 members to the Industrial Advisory Committee (IAC).
Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
In a newly-published study, a team of researchers in Oxford University’s Department of Materials led by Harish Bhaskaran, Professor of Applied Nanomaterials, describe a breakthrough approach to pick up single nanowires from the growth substrate and place them on virtually any platform with sub-micron accuracy.
Saras Micro Devices Selects Technology Manufacturing Site in Arizona
Saras Micro Devices has selected a site in the Price Corridor in Chandler, AZ to build out a manufacturing facility for its advanced power delivery solutions.
Reimagining the Future: Why Semiconductor Fabs Need a New Breed of MES Today
How much value could a smooth, coherent flow of data across the fab and wider enterprise give to the business?
Automotive IC Marketshare Seen Rising to 10% by 2026
Automotive IC sales expected to post average annual growth of 13.4%; Communications and Computer segments remain largest applications.
Scalable and Fully Coupled Quantum-inspired Processor Solves Optimization Problems
Researchers experimentally demonstrate the first fully connected annealing processor that can be scaled up across multiple chips.
ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions.
