RIBER is announcing an order for a MBE 6000 production system in Asia for a total amount of several million euros.
Semiconductors
Scaling Progress Takes Many Paths at VLSI Symposium
The IEEE 2022 Symposium on VLSI Technology and Circuits attracted 650 people to attend in person in Honolulu, and an equal number of virtual attendees.
Materion Establishes New Facility to Accelerate Growth in the Semiconductor and Electric Vehicle Markets
Materion Corporation announced today that it has established a new facility in Milwaukee, Wisconsin to accelerate the growth of advanced chemical solutions for the semiconductor and electric vehicle (EV) battery markets.
The National Institute for Innovation and Technology Announces National Talent Hub
National Institute to grow the nation’s talent pipeline for the semiconductor industry and nanotech sectors.
Strategic Materials Conference 2022 to Spotlight Innovations Paving the Way to $1 Trillion Semiconductor Industry
With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2022) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials October 3-5, 2022 at the DoubleTree by Hilton in San Jose, Calif.
JCET Begins Construction of a New High-End Manufacturing Base in Jiangyin
The “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project,” officially started construction of JCET’s new plant in Jiangyin City of Jiangsu province.
Gigaphoton Increases Production Capacity for Excimer Laser Light Sources with Construction of New Building
Gigaphoton Inc., a manufacturer of lightsources used in semiconductor lithography, has announced that it will increase its production capacity by 2.5 times through the construction of the new building.
MPI Corporation has Installed its WaferWalletMAX for 200mm and 300mm WLR Processes
MPI Corporation’s Advanced Semiconductor Test Division, an industry and innovation leader of semiconductor test solutions initiated the integration of the TS3500-SE automated wafer probe test system with WaferWallet MAX, a multi-purpose cassette, FOUP self-docking 200mm and 300mm handling solution, into a leading WLR test process.
High Performance Waveguide Devices for Next Generation Photonic Chips
In a new paper published in Light Science & Application, a team of scientists at the University of Oxford, collaborated with Prof. Alina Karabchevsky of Israel, Prof. Alexander Jesacher of Austria, and Prof. Ian A. Walmsley of Imperial College London, have developed a new technology named “SPIM-WGs”.
Industry Reacts to Passage of CHIPS and Science Act of 2022
Semiconductor companies around the globe issued statements on Thursday following the passage of legislation of the CHIPS and Science Act of 2022 in the U.S. House of Representatives aimed at increasing American semiconductor manufacturing.
