TANAKA Kikinzoku Kogyo K.K. has announced that it will establish a new building at the Hukou Plant in Hsinchu County, Taiwan.
Semiconductors
LPE and A*STAR’s Institute of Microelectronics to Develop High Quality 200mm SiC and Specialty Epitaxy Processes
LPE and the Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) have announced a research collaboration to develop high quality 200mm silicon carbide (SiC) and specialty epitaxy processes including enhanced growth rates with improved uniformity.
Magnetic Memory Milestone
Developments in the field of spintronics promise faster, more efficient devices.
NXP Collaborates with Foxconn on Next Generation Vehicle Platforms
NXP Semiconductors today announced that it has signed a memorandum of understanding with Hon Hai Technology Group to jointly develop platforms for a new generation of smart connected vehicles.
ClassOne Equipment Acquires Major Semiconductor Fab’s Complete Chip Manufacturing Line for Resale
ClassOne Equipment has announced its acquisition of a major fab’s complete line of production tools for resale.
SEMI Applauds Senate Progress on CHIPS Act of 2022, Urges Timely Congressional Approval
SEMI today applauded progress in the United States Senate on a robust package of federal incentives for the semiconductor supply chain and urged its timely passage in Congress.
SkyWater Technology Chooses Discovery Park District at Purdue for $1.8B Semiconductor Fabrication Facility, to Create 750 Jobs in 5 Years
The announcement Wednesday (July 20) by SkyWater Technology that it plans to open a $1.8 billion state-of-the-art semiconductor manufacturing facility in Discovery Park District at Purdue University marks a huge step forward for the American semiconductor industry, Purdue’s thriving innovation district and the university’s continued emergence as one of the principal drivers of the Indiana economy.
2022 Semiconductor Photoresists: Growth Continues Strong Through 2026
Growth is expected as revenues are predicted to increase by 7.5% in 2022 to reach almost US$2.3 billion.
Moov Secures David Arkow as Head of Global Sales to Further Leadership in Used Semiconductor Equipment Market
Moov, a data-fueled marketplace for used semiconductor manufacturing equipment, today welcomed David Arkow as the company’s head of global sales.
Emerging Metrology Requirements for Heterogeneous Integration and 3D Packaging
The ability to speed up the deployment of heterogeneous integration in mass production requires new and more frequent types of measurements in key manufacturing processes, including wafer and die bonding as well as lithography.
