ClassOne Equipment has just introduced two new high-performance Takano particle inspection systems for ≤200mm and ≤300mm unpatterned wafers.
Semiconductors
DENSO and USJC Collaborate on Automotive Power Semiconductors
DENSO Corporation and United Semiconductor Japan Co., Ltd. today announced that the companies have agreed to collaborate on the production of power semiconductors at USJC’s 300mm fab in order to serve the growing demand in the automotive market.
Advantest ACS Nexus Enables Real-time Data Analytics for Semiconductor Test
New ACS Nexus enables real-time data streaming from distributed test floors across the semiconductor supply chain for the analytics solutions of customers and third-parties.
BSE Wins Multiple Orders from Leading OSAT for Zeus Gravity Test Handler for Automotive IC Handling
Boston Semi Equipment, a global semiconductor test handler and test automation company, announced today that it has received multiple orders for its Zeus gravity test handler from a major outsourced semiconductor assembly and test (OSAT) customer.
Imec Ramps Up the Development of the High-NA EUV Patterning Ecosystem
This week, at the 2022 SPIE Advanced Lithography and Patterning Conference, imec presents significant progress in preparing the High-NA patterning ecosystem for the imec-ASML Joint High-NA Lab.
Wafer Capacity Forecast to Climb 8.7% As 10 New Fabs Enter Production
Even with more fabs, strong unit growth will keep industry capacity utilization at 93.0% in 2022.
Taiwan to Control 48% of Global Foundry Capacity in 2022, Says TrendForce
According to TrendForce, Taiwan is crucial to the global semiconductor supply chain, accounting for a 26% market share of semiconductor revenue in 2021, ranking second in the world.
GlobalFoundries Announces Expiration of the Hart-Scott-Rodino Waiting Period for Transfer of Ownership of East Fishkill, NY Facility to onsemi
The expiration of the HSR waiting period satisfies all of the necessary regulatory requirements and the transaction is on track to close at the end of 2022 as planned.
Breakthrough for Efficient and High-Speed Spintronic Devices
INRS researchers and international partners have succeeded in looking at spin inside rare earth materials, using a tabletop ultrafast soft-X-ray microscope, for the first time.
Nomination Deadline Extended to May 27: Phil Kaufman Hall of Fame Sponsored by ESD Alliance and IEEE CEDA
The nomination deadline for the Phil Kaufman Hall of Fame for Distinguished Contributions to Electronic System Design has been extended to Friday, May 27, the Electronic System Design Alliance (ESD Alliance) and the IEEE Council on Electronic Design Automation (CEDA), sponsors of the honor, announced today.
