Semiconductors

SIA, FIRST Announce Partnership to Strengthen U.S. STEM Workforce

Partnership will focus on enhancing talent pipeline to equip students with skills needed for science and technology careers.

A New Age of 2.5D Materials

2.5-dimensional materials promise new applications for artificial intelligence, electronics, automobiles and the energy sector.

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

ACM Research, Inc. today announced that a volume purchase contract has been received from a leading Chinese OSAT for 10 Ultra ECP ap high-speed plating tools, which are scheduled to be delivered later in 2022 and 2023.

Industry R&D Spending To Rise 9% After Hitting Record in 2021

New update shows Intel continues to lead research and development ranking, the top 10 raised spending 18% last year, and 21 companies invested $1 billion or more on R&D in 2021.

MaxLinear to Acquire Silicon Motion

Business combination roughly doubles MaxLinear’s total addressable market opportunity to $15 billion and creates a top-ten fabless semiconductor supplier.

New Shape Memory Alloy Discovered Through Artificial Intelligence Framework

Funded by the National Science Foundation’s Designing Materials to Revolutionize Our Engineering Future (DMREF) Program, researchers from the Department of Materials Science and Engineering at Texas A&M University used an Artificial Intelligence Materials Selection framework (AIMS) to discover a new shape memory alloy.

Purdue, Ivy Tech Partner on Next-Generation Microelectronics Workforce

Purdue University and Ivy Tech Community College are partnering to help meet the future workforce needs in microelectronics, a field that is expected to add more than 100,000 workers over the next decade.

What’s in the April/May Issue?

Each issue of Semiconductor Digest has articles found only in the magazine! Read the
April/May issue online here.

Soitec On Track to Enlarge Silicon Carbide Product Portfolio with First 200mm SmartSiC Engineered Substrate

Soitec (Euronext Paris) has released its first 200mm silicon carbide SmartSiC wafer.

SEMI Veteran Paul Trio Takes Reins of SEMI Standards Program

SEMI today announced the promotion of 20-year SEMI veteran Paul Trio to Director of the SEMI International Standards program, effective immediately.

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