A POSTECH research team led by Professor Yong-Young Noh and Ph.D. candidates Ao Liu and Huihui Zhu (Department of Chemical Engineering), in collaboration with Professor Myung-Gil Kim (School of Advanced Materials Science and Engineering) of Sungkyunkwan University, has improved the performance of a p-type semiconductor transistor using inorganic metal halide perovskite.
Semiconductors
“Hot” Spin Quantum Bits in Silicon Transistors
Quantum bits (qubits) are the smallest units of information in a quantum computer. Currently, one of the biggest challenges in developing this kind of powerful computer is scalability. A research group at the University of Basel, working with the IBM Research Laboratory in Rüschlikon, has made a breakthrough in this area.
Quantum Physics Sets a Speed Limit to Electronics
Semiconductor electronics is getting faster and faster – but at some point, physics no longer permits any increase. The shortest possible time scale of optoelectronic phenomena has now been investigated.
Nexperia Officially Launches New Dallas Design Center
First R&D Facility in North America enables entry to power management IC market.
Analog Market Momentum to Continue Throughout 2022
Market forecast of 12% growth in 2022 follows historic 30% jump in analog sales in 2021.
Pusan National University Scientists Review Latest Progress in Wearable Energy Harvesting and Storage
Pusan National University scientists take stock of the latest developments in energy harvesting and storage technology for wearable devices, with a focus on nanomaterials and their assembly into various macroscale structures.
CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
CEA, a French key player in research, development and innovation, and C12 Quantum Electronics, a startup focused on developing the next-generation of quantum computers using carbon nanotubes, today announced a partnership to produce the first multi-qubit chips at wafer scale.
Lam Research President and CEO Tim Archer Testifies Before the United States Senate Commerce Committee
Lam Research Corp. President and CEO Tim Archer testified today before the United States Senate Committee on Commerce, Science, and Transportation for a hearing entitled, “Developing Next Generation Technology for Innovation.”
Kioxia Corporation to Expand 3D Flash Memory Production Capacity by Building New Fabrication Facility at Kitakami Plant
Kioxia Corporation today announced it will begin construction of a new fabrication facility (Fab2) at its Kitakami Plant in Iwate Prefecture, Japan for the possible expansion of production of its proprietary 3D Flash memory BiCS FLASH.
Global Fab Equipment Spending Expected to Hit New High of $107 Billion in 2022, SEMI Reports
Industry drive to expand and upgrade capacity to push spending over $100 billion for first time.
