Semiconductor supply chain sustainability and resilience will come into sharp focus 21-23 June 2022 as SEMICON Southeast Asia, the region’s premier gathering of the semiconductor and microelectronics industry, returns to the Setia SPICE Convention Centre & Arena in Penang, Malaysia following a two-year hiatus due to the pandemic.
Semiconductors
NGI Uses Twist to Engineer 2D Semiconductors With Built-In Memory Functions
A team of researchers at The University of Manchester’s National Graphene Institute (NGI) and the National Physical Laboratory (NPL) has demonstrated that slightly twisted 2D transition metal dichalcogenides (TMDs) display room-temperature ferroelectricity.
Samsung’s LPDDR5X DRAM Validated for Use with Qualcomm Technologies’ Snapdragon Mobile Platforms
Samsung Electronics Co., Ltd. today announced that Qualcomm Technologies, Inc. has validated Samsung’s 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM for use on Qualcomm Technologies’ Snapdragon mobile platforms.
Renesas and Fixstars to Establish Automotive SW Platform Lab to Develop Software and Operating Environments for Deep Learning
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, and Fixstars Corporation, a developer of multi-core CPU/GPU/FPGA acceleration technology, announced their intention to collaborate in the automotive deep learning field.
Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Ferroelectric Devices Forge Ahead
At IEDM 2021 the new star of the emerging memory firmament was ferroelectric memories, either in 1T/1C (FeRAM) or 1T (FeFET) structures.
Scanning Electron Microscopy Takes the Spotlight in Annual Deep Learning Survey by the eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today published its second annual Deep Learning (DL) survey of its members’ products and applications using DL in the photomask to wafer manufacturing flow.
Samco Opens Research Center for Nano Thin Films & Materials to Accelerate ALD Development
Samco, a manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, has opened the new Research Center for Nano Thin Films & Materials for ALD and mist CVD process and system development in Kyoto, Japan.
Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD
Micron Technology, Inc., today announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center.
CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and integrated IP solutions, today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by CEVA licensees since the beginning of 2020.
