Process Insights, a Union Park Capital portfolio company, announced today that it has acquired Guided Wave Inc. from Singapore-based Advanced Holdings Ltd.
Semiconductors
Movandi Collaborates With Qualcomm to Expand 5G mmWave Adoption
Movandi today announced that it has plans to collaborate with Qualcomm Technologies, Inc. to expand the adoption of 5G mmWave deployment for indoor and outdoor scenarios.
Key Foundry Begins Mass Production of Power Semiconductors Using 0.18 micron High Voltage BCD Process
Key Foundry, the only pure-play foundry in Korea, announced today that it has begun the mass production using its 0.18 micron high voltage BCD (Bipolar-CMOS-DMOS) process.
onsemi Divests Wafer Manufacturing Sites as Part of Fab-Liter Strategy
Company entered into definitive agreement to sell its South Portland, Maine fab and closed sale of Belgium fab.
Improved Fuel Cell Performance Using Semiconductor Manufacturing Technology
Development of metal nanoparticle synthesis methods for eco-friendly mass production using sputtering application, a metal deposition technology. Applicable to high-performance hydrogen fuel cell catalysts.
SEMI Survey Highlights Member Recommendations for U.S. Chip Industry Competitiveness, Government Investment
SEMI, the industry association representing the global electronics design and manufacturing supply chain, today released the results of a survey of more than 400 U.S. member companies that highlight challenges facing the semiconductor industry.
UMC Announces New 22nm Wafer Fab in Singapore
United Microelectronics Corporation, a global semiconductor foundry, today announced that its Board of Directors has approved a plan to build a new advanced manufacturing facility next to its existing 300mm fab (Fab12i) in Singapore.
SIA Statement on Sanctions on Russia
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding new export control rules announced today in response to Russia’s invasion of Ukraine.
Secure-IC Launches a Unique Cybersecurity Lifecycle Management Platform for Connected Objects
After recently announcing its capital raise to support its “Chip to Cloud” vision, Secure-IC, the provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today the launch of a unique cybersecurity lifecycle management platform for connected objects (Securyzr integrated Security Services Platform).
Count of Semiconductor Fabs Using 300mm Wafers Projected to Exceed 200 by 2026
At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.
