Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, announced it has entered into a long-term supply agreement with onsemi, a leading manufacturer of advanced energy-efficient power semiconductors.
Semiconductors
ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced its new Panel Electrochemical Plating (Ultra ECP ap-p) tool designed for fan-out panel-level packaging (FOPLP).
New Substrate Material for Flexible Electronics Could Help Combat E-Waste
Electronic waste is a rapidly growing problem, but this degradable material could allow the recycling of parts from many single-use and wearable devices.
New SEMI Foundation and Policy Equity Group Collaboration Earns Funding to Address Semiconductor Industry Child Care Gaps
Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act.
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility
The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D.
Insight Global Launches Semiconductor Apprenticeship Program to Address Talent Shortages
Insight Global announced the launch of its new U.S. Department of Labor-approved Semiconductor Apprenticeship Acceleration Program (SAAP).
NEO Semiconductor Announces the Development of its 3D X-AI Chip
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the development of its 3D X-AI chip technology, targeted to replace the current DRAM chips inside high bandwidth memory (HBM) to solve data bus bottlenecks by enabling AI processing in 3D DRAM.
Polymatech Electronics Acquires Nisene Technology Group Inc.
Polymatech Electronics, India’s first semiconductor chip maker, has officially announced its acquisition of Nisene Technology Group Inc., California, USA, a company with a 50-year history in the semiconductor industry.
Yongjiang Laboratory Orders Reactive Ion Beam Trimming Equipment from scia Systems
The scia Trim 200 system provides precise surface correction in film and wafer materials using ion beam trimming. The film thickness uniformity can be adjusted up to 0.1 nm.
Global Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023
The Semiconductor Industry Association (SIA) today announced global semiconductor industry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024.
