After recently announcing its capital raise to support its “Chip to Cloud” vision, Secure-IC, the provider of end-to-end cybersecurity solutions for embedded systems and connected objects announced today the launch of a unique cybersecurity lifecycle management platform for connected objects (Securyzr integrated Security Services Platform).
Semiconductors
Count of Semiconductor Fabs Using 300mm Wafers Projected to Exceed 200 by 2026
At the end of 2021, there were 153 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.
Manoj R. Shah, Former Professor of Practice at Rensselaer Polytechnic Institute, Elected to the National Academy of Engineering
Manoj R. Shah, former Professor of Practice at Rensselaer Polytechnic Institute, has been elected to the National Academy of Engineering (NAE) for his “technical advancements in design, analysis, and applications of electric machines.”
Supplyframe Consumer Research Highlights Shifting Car Buying Behaviors, Consumer Sentiment About the Automotive Industry
Supplyframe today released research indicating that most consumers anticipate negative fallout from supply chain shortages fueled by the pandemic to continue throughout 2022.
Worldwide Semiconductor Assembly and Test Facility Database Now Tracks Integrated Device Manufacturers, 475 Facilities
SEMI and TechSearch International today announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated device manufacturer (IDM) facilities.
Nova Expands Presence in China with New Office in Shanghai
Nova today announced the establishment of its new Chinese local corporate entity and the opening of a new Chinese headquarters in Shanghai.
New Multilayer Coating System for Wafers up to 300mm Diameter by Magnetron Sputtering
The scia Multi 300, the new magnetron sputter system by German thin film equipment manufacturer scia Systems, produces precise multilayer-stacks on 300 mm wafers. The Helmholtz-Zentrum Dresden-Rossendorf (HZDR) uses the system already to produce flexible and printable magnetic field sensors.
NXP Launches S32G Vehicle Integration Platform to Help Accelerate Software-Defined Vehicle Development
NXP Semiconductors has launched the S32G GoldVIP to help address real-time and application development challenges of software-defined vehicles using S32G vehicle network processors.
GaN Systems 3X Growth Drives Massive Expansion in Asia
GaN Systems, a developer of GaN power semiconductors, announced today it has expanded its Asia presence with a 3X increase in its operation in Taiwan.
Imec, KU Leuven and PragmatIC Semiconductor Demonstrate Fastest 8-bit Flexible Microprocessor for Low-Power Applications
This week, at the 2022 International Solid-State Circuits Conference (2022 ISSCC), imec, a research and innovation hub in nanoelectronics and digital technologies, KU Leuven, and PragmatIC Semiconductor, a developer of flexible electronics, present the fastest 8-bit microprocessor in 0.8µm metal-oxide flexible technology capable of running real-time complex assembly code.
