Semiconductors

Advancing the Future of Semiconductor Manufacturing

Manufacturing innovation can be achieved through greater capacity utilization, component reliability, and process control.

TANAKA Denshi Kogyo to Establish New Plant in Hangzhou, China

TANAKA Holdings Co., Ltd. has announced that its subsidiary, TANAKA Denshi Kogyo K.K., which is engaged in the production of various types of bonding wires, will establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors.

SEMI Issues Recommendations for European Commission to Bolster Europe’s Chip Ecosystem Resilience and Competitiveness

SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, has issued recommendations to the European Commission for growing Europe semiconductor ecosystem resilience and competitiveness.

Micron Announces CFO Transition

Micron Technology, Inc. today announced that David Zinsner, executive vice president and chief financial officer, has resigned from the company.

Imec Tenure-Track Holder Christian Haffner Awarded With ERC Starting Grant

Today, imec, the research and innovation hub in nanoelectronics and digital technologies, announces that the European Research Council (ERC) has awarded a prestigious Starting Grant to Christian Haffner.

SPIE, the International Society for Optics and Photonics, Announces Its 2022 Society Awards

The Awards Committee of SPIE, the international society for optics and photonics, today announced the recipients of its prestigious annual awards.

Global Fab Equipment Spending Projected to Log Record High in 2022 to Mark Third Consecutive Year of Growth, SEMI Reports

Global fab equipment spending for front end facilities is expected to rise 10% year-over-year (YOY) in 2022 to a new all-time high of over US$98 billion, marking a third consecutive year of growth, SEMI highlighted today in its quarterly World Fab Forecast report.

AI, Cameras and Your Smartphone: Computing at the Edge and On the Go

An AI-powered camera using a dedicated co-processor chip with innovative deep learning algorithms can deliver a vision-based solution with unmatched performance, power efficiency, cost-effectiveness, and scalability.

proteanTecs and Alchip Bring Production Visibility to Advanced ASICs

proteanTecs, a developer of deep data solutions for electronics health and performance monitoring, announced today a commercial agreement with Alchip Technologies Ltd., a high-performance computing ASIC company, to provide ASIC production visibility to fabless semiconductor companies in Greater China.

A*STAR’s Institute of Microelectronics and Soitec to Develop Next-Generation Silicon Carbide Semiconductors

The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec (Euronext Paris) have announced a research collaboration to develop next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles and advanced high-voltage electronic devices.

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