Navitas Semiconductor, a developer of gallium nitride (GaN) power integrated circuits, has announced that it will take part in Baird’s 2021 Global Industrial Conference on November 11th.
Semiconductors
KLA Announces Grand Opening of $200 Million Second Headquarters in Ann Arbor, Michigan
KLA Corporation today announced the official opening of its second U.S. headquarters, a $200 million facility in Ann Arbor, Michigan.
Pure Storage Partners with Microsoft Azure to Speed Semiconductor Design
Pure Storage today announced it has partnered with Microsoft Azure to significantly speed next-gen chip design by delivering a data layer that can keep up with massive, concurrent high-performance computing (HPC) workloads running in the cloud.
DuPont and Kempur Microelectronics Announce Collaboration
DuPont Electronics & Industrial and Kempur Microelectronics, Inc. today announced a collaboration program to supply materials for microlithography in China.
Trymax Moves to a New Green Manufacturing Facility
Trymax Semiconductor Equipment BV (Trymax), a developer of plasma solutions for semiconductor manufacturers, announces the move to a new green manufacturing facility.
Global Semiconductor Alliance Announces 2021 Award Nominees
The Global Semiconductor Alliance (GSA) announced its 2021 award nominees. The prestigious awards will be presented at GSA’s Virtual Awards Celebration on Thursday, Dec. 9, 2021.
New Ultra-High Material Efficient, Low-Cost Solar Cells — Using Nanowires
A research group at the Norwegian University of Science and Technology (NTNU) has developed a method for making an ultra-high material efficient solar cell using semiconductor nanowires.
Energetiq Technology Adds New VP of Quality and Environmental Compliance
Dr. Tichenor brings over 18 years’ executive experience in quality, reliability, and environmental health and safety, most recently as the VP of Quality and Reliability at Gatan, Inc.
French Semiconductor Ecosystem: Design House IC’Alps Raises €4.2 Million To Sustain Business Growth For Custom Chip Design
Acting on General Shareholders Meeting, semiconductor company IC’Alps announced today it has raised €4.2 Million from French industrial group DOLIAM.
ACM Research Receives Orders from a Leading Global IDM for Wet Stripping Systems for Wafer-Level Packaging
ACM Research, Inc. today announced receipt of two orders for ACM’s Ultra C pr wet stripping system from a leading global integrated device manufacturer (IDM).