Semiconductor fabs are shifting to automated production and sensors are at the core of the transformation, ensuring absolute process control and product quality in today’s challenging landscape.
Semiconductors
How Semiconductor Innovations are Transforming Autonomous Vehicles
With advanced driver-assistance systems (ADAS) becoming more sophisticated and artificial intelligence (AI) pushing the boundaries of vehicle autonomy, semiconductors in the automotive industry are witnessing a revolution.
EV Group Unveils Next-Generation GEMINI Automated Production Wafer Bonding System
EV Group today unveiled the next-generation version of its GEMINI automated production wafer bonding system for 300mm wafers.
Critical Manufacturing MES Supports Plessey’s Experimental MicroLED Processes
Critical Manufacturing announced that Plessey, renowned for its microLED display technology, has selected Critical Manufacturing MES to support its manufacturing workflows.
Imec Honors Apple’s Johny Srouji with the 2025 Innovation Award
Imec announced today that Johny Srouji, Apple’s senior vice president of hardware technologies, will receive the 2025 imec Innovation Award.
Multiple Vectors Tackle Memory Bandwidth
Hybrid bonding and new memories are enabling bandwidth gains.
DesignCon, DeepSeek and What’s Next for Chip Designers
With the continued, explosive demand for AI-specific chips, the semiconductor industry is being faced with increasingly high expectations and challenges. It’s also speeding up design cycles across the board.
Twisting Atomically Thin Materials Could Advance Quantum Computers
Placing two layers of special 2D materials together and turning them at large angles creates artificial atoms with intriguing optical properties.
Qolab Secures Investment from Applied Ventures
Qolab, Inc., an innovator in quantum computing hardware, today announced an investment from Applied Ventures, LLC, the venture capital arm of Applied Materials, Inc.
onsemi Launches Silicon Carbide-Based Intelligent Power Modules
Today, onsemi introduced the first generation of its 1200V silicon carbide (SiC) metal oxide semiconductor field-effect transistor (MOSFET) based SPM 31 intelligent power modules (IPMs).
