TESCAN ORSAY HOLDING a.s. launches the new Large Volume Workflow for faster failure and defect root-cause analysis in semiconductor manufacturing and materials research.
Semiconductors
Applied Materials Unveils eBeam Metrology System that Enables a New Playbook for Patterning Advanced Logic and Memory Chips
Applied Materials, Inc. today unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.
PragmatIC Semiconductor Secures $80M Funding
PragmatIC Semiconductor announced that it has secured $80 million of Series C funding.
Intelligent Optical Chip to Improve Telecommunications
An INRS team uses autonomous learning approaches for optical waveform generators to boost optical signal processing functionalities for current and future telecom applications.
Veeco Receives Multi-System Order for New, Dual-Technology Platform that Enables Next Generation Power Electronic Devices
Veeco Instruments Inc. announced today that it has received a multi-system order for its new ADS-800 SRD System from a leading semiconductor supplier.
IBM Commits to Skill 30 Million People Globally by 2030
IBM today unveiled a groundbreaking commitment and global plan to provide 30 million people of all ages with new skills needed for the jobs of tomorrow by 2030.
IC Industry at Heart of Possible China Takeover of Taiwan
Combined, China and Taiwan would hold about 37% of global IC capacity, almost 3x that of North America.
Rambus Advances Server Memory Performance with the Industry’s First 5600 MT/s DDR5 Registering Clock Driver
Rambus Inc. (NASDAQ: RMBS), a chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.
New Nanostructure Could Be the Key to Quantum Electronics
Using a completely new synthesis approach, nanostructures made of aluminium single crystals and the semiconductor germanium are jointly explored at TU Wien and CNRS-UGA Grenoble for future quantum technologies.
Contributing to Solve the Heat Concentration Problem in Power Semiconductors
In high-performance CPUs used in large servers and power semiconductors used in inverters for hybrid electric vehicles (HEVs), as the integration density rises and the higher the power consumption becomes, the semiconductor package is also becoming smaller.
