A team of scientists led by Nanyang Technological University (NTU Singapore) and Rice University in the US, has uncovered the key to the outstanding toughness of hexagonal boron nitride (h-BN).
Semiconductors
Dominant Factor of Carrier Transport Mechanism in Multilayer Graphene Nanoribbons Revealed
Researchers precisely set the number of layers in multilayer graphene nanoribbons, controlling the semiconducting and metallic properties of field effect transistors and establishing a design guideline for the practical applications of graphene devices.
Samsung’s Semiconductor Sites Awarded Industry’s First ‘Triple Standard’ by Carbon Trust
All of Samsung’s global semiconductor manufacturing facilities certified for reducing carbon emissions, water use and waste discharge.
Hua Hong Semiconductor Achieved Mass Production of 12” 90nm BCD
Hua Hong Semiconductor Limited, a global specialty pure-play foundry, announced that its 90nm BCD process has received wide recognition from customers for its high performance index and compact chip size, and mass production has been achieved on Hua Hong Wuxi’s 12” production line.
IBM Announces 2nm GAA-FET Technology – the Sum of “Aha!” Moments
IBM likes to create a stir once in awhile, and judging by the tech-press response in the last week or three, they have achieved that goal with their announcement of 2-nanometer CMOS technology, developed at their Albany research centre. This technology is expected to give a 45% performance boost or 75% power reduction, compared with a 7-nm process. Of course the question is, compared with what 7-nm process?
NXP Announces Two Processors on TSMC 16nm FinFET Technology
NXP Semiconductors N.V. and TSMC today announced the release of NXP’s S32G2 vehicle network processors and the S32R294 radar processor into volume production on TSMC’s advanced 16nm FinFET process technology.
Micron Unveils 176-Layer NAND and 1-Alpha DRAM
Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.
First Quarter 2021 Global Semiconductor Equipment Billings Increase 51% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 51% year-over-year and 21% from the prior quarter to US$23.6 billion, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
TSMC Unveils Innovations at 2021 Online Technology Symposium
TSMC is unveiling its latest innovations in advanced logic technology, specialty technologies, and TSMC 3DFabric advanced packaging and chip stacking technologies at the Company’s 2021 Technology Symposium.
Inova Semiconductors Implements YieldWatchDog as Yield Management Solution
DR YIELD software & solutions GmbH, provider of the smart data analytics solution YieldWatchDog, announces that they were selected by Inova Semiconductors GmbH to enable actionable insights into their chip test data.
