In the face of escalating climate crises and a dramatic rise in global energy demands, governments and industries are committing to ambitious climate goals aimed at mitigating environmental impact and securing a sustainable future.
Semiconductors
UT’s Texas Institute for Electronics Awarded $840M To Build a DOD Microelectronics Manufacturing Center
Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense.
Carrie Esko Joins SIA Team
The Semiconductor Industry Association (SIA) today announced Carrie Esko has joined the SIA team. Esko will serve as director of global policy for trade and supply chain matters.
MEMS Industry: Poised for a Resilient Comeback?
Despite challenges, the MEMS industry is set for robust growth and technological advancements.
CMOS Image Sensor Industry: A Growing Market with Evolving Technologies
Technological advancements and market dynamics propel the CIS industry forward.
System-Level Simulations, Sub-System Digital Twins, 2.5D Heterogeneous Integration, UCIe and CMOS 2.0
Chip design simulation remains an important tool, but manufacturing and supply chain simulators are equally critical – e.g., digital twins and chiplets. Die hardware integration security looks to be the new threat target for modern systems, and CMOS 2.0 may make the challenge even more significant.
Chips Joint Undertaking and Republic of Korea Initiate Groundbreaking Semiconductor Collaboration
This partnership aims to foster technological advancements, enhance supply chain resilience, and secure a leading position in the global semiconductor industry.
EtherCAT Technology Group’s Semiconductor Working Group Hosts 25th Meeting in Silicon Valley
In addition to the regular work on profiles for the semiconductor industry, the group also took time to look back on the successes of the working group since it was founded in 2011.
Biden-Harris Administration Announces Preliminary Terms with GlobalWafers
The proposed CHIPS investment would support the construction of new wafer manufacturing facilities and the creation of 1,700 construction jobs and 880 manufacturing jobs.
How Etch Breakthroughs Are Tackling 3D NAND Scaling Challenges on the Path to 1,000 Layers
As the industry now looks towards the 1,000-layer roadmap by the end of decade or soon thereafter, there are some critical challenges. Lam is working actively with leading customers to address these in time through innovations in etch, as well as other advanced manufacturing processing steps.
