Applied Materials, Inc. today announced materials engineering solutions that give its memory customers three new ways to further scale DRAM and accelerate improvements in chip performance, power, area, cost and time to market (PPACt).
Semiconductors
ROHM’s Expanded Lineup of High-Power Shunt Resistors Contributes to Miniaturization in High-Power Applications
ROHM Semiconductor today announced the development of the GMR320 series of shunt resistors featuring a rated power of 10W, the largest in the high-power, low-ohmic GMR lineup designed for high-power applications in the automotive, industrial equipment, and home appliance sectors.
Closing In on State-of-the-Art Semiconductor Solar Cells
Mixed-cation single crystals narrow the gap between perovskite and top-performing semiconductor solar cells. A synthetic approach that improves absorber layers in perovskite solar cells could help them achieve their full potential and draw closer to the performance of leading gallium arsenide devices.
Trelleborg Launches its ‘Fab Four’ FFKM Materials for the Most Critical Semiconductor Sealing Applications
Trelleborg Sealing Solutions launches four materials in its Isolast PureFab range, specifically engineered for critical semiconductor sealing applications.
3D-Micromac Signs MOU with dpiX to Formalize Partnership
dpiX and 3D-Micromac America today announced the signing of a Memorandum of Understanding (MOU) that outlines the companies’ cooperation in the development, prototyping and manufacturing of laser-manufactured, flat-panel semiconductors.
Semtech and EchoStar Mobile to Test Satellite IoT Connectivity Service Integrated With LoRaWAN
Semtech Corporation and EchoStar Corporation announced the launch of an initiative to test satellite connectivity services enabled by the LoRaWAN protocol.
Gel-Pak Collaborates with BAE Systems on Packaging Solution for Thin Semiconductor Devices
Gel-Pak, a division of Delphon and a manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on a new product called the Lid/Clip Super System (LCS2).
Q1 Global Semiconductor Sales Increase 3.6% Over Previous Quarter
Worldwide sales for March increase 17.8% year-to-year, 3.7% month-to-month.
Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
Worldwide silicon wafer area shipments increased 4% to 3,337 million square inches in the first quarter of 2021 compared to the fourth quarter of 2020, topping the previous historical high set in the third quarter of 2018, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Silicon Integration Initiative Targets New Silicon Carbide Standard SPICE Model
The Si2 Compact Model Coalition has voted to fund and standardize a SPICE model for silicon carbide-based metal-on-silicon field-effect transistors.
