Transphorm, Inc. announced today the close of the transaction for the acquisition of 100% interest in the Company’s AFSW wafer-fab facility by GaNovation, Transphorm’s recent joint venture with Palo Alto-based JCP Capital, a new strategic-financial partner.
Semiconductors
Heterogeneous Epitaxy of Semiconductors Targeting the Post-Moore Era
A research team led by Prof. LIU Zhiqiang from the Institute of Semiconductors of the Chinese Academy of Sciences, in cooperation with the team led by Prof. GAO Peng from Peking University and the team led by Prof. LIU Zhongfan from Beijing Graphene Institute (BGI), recently realized the concept of “heterogeneous epitaxy” via a van der Walls strategy, a type of nonsymmetrical epitaxy process.
New Material Offers Ecofriendly Solution to Converting Waste Heat into Energy
A team of scientists from Northwestern University and Seoul National University in Korea now has demonstrated a high-performing thermoelectric material in a practical form that can be used in device development.
In-line Airborne Particle Sensing – A Streamlined Contamination Solution for Cleanroom Environments
The IPS relieves pains of traditional monitoring methods while simultaneously increasing tool time and improving yields.
IC Insights Forecasts a 21% Surge in IC Unit Shipments This Year
A 21% jump would be the largest increase in IC unit shipments since the boom year of 2010.
Merck Launches New Green Solvents for Photoresist Removal in Chip Production
Merck today announced the launch of a new line of complementary green solvents for use in photolithographic processes in semiconductor manufacturing.
CVD Completes the Sale of its 555 North Research Place Facility
CVD Equipment Corporation today announced it closed on the sale of its facility located at 555 North Research Place, Central Islip, New York for the purchase price of $24,360,000.
Covalent Metrology Expands Analytical Chemistry Capabilities with Triple-Quadrupole Inductively Coupled Plasma Mass Spectrometry
Covalent Metrology announces an expansion of its chemical analysis capabilities with the install of a Thermo Scientific iCAP TQ for inductively coupled plasma mass spectroscopy (ICP-MS)
Boston Start-up JETCOOL Technologies Inc. Offers Solution to the Global Semiconductor Chip Shortage
The semiconductor chip shortage wreaking havoc on the automotive and tech industries is forecasted to reach into 2023.
Micron Launches World’s First 176-Layer NAND in Mobile Solutions
Micron Technology, Inc. announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution.
