Samco, a manufacturer of plasma processing equipment for the compound semiconductor industry, announced that the Indian Institute of Technology Delhi (IIT Delhi) has selected a Samco Multi-Chamber CVD system to develop a Heterojunction with Intrinsic Thin-layer (HIT) solar cell.
Semiconductors
Multilayer Thickness Evaluation of Semiconductor and Display Structures by Picosecond Ultrasonics
The product line JAX designed by Neta uses unique properties of femtosecond pulses and photo-acoustic effects to inspect thin films stacks. This 100% non-destructive optical method can be used to test and control multilayers which are typical from applications in the semiconductor or in the display industries.
LiDAR Laser Circuit Optimization and Measurement
A method of measurement is described that provides the necessary feedback to correctly evaluate laser diode and driver performance and changes in spectral response with temperature simultaneously.
SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing and Research in American Jobs Plan
SEMI today applauded the inclusion of initiatives to strengthen U.S. semiconductor manufacturing and research and calls for investment in the Biden Administration’s American Jobs Plan.
Optoelectronics, Sensors/Actuators, and Discretes Gain Momentum
Total O-S-D sales set a record high in 2020 despite the Covid-19 virus crisis wrecking the global economy. In a 2021 rebound, optoelectronics is expected to join sensors/actuators and discretes in strong growth.
New RA6M5 Group from Renesas Completes Mainstream Line of RA6 Series Arm Cortex M33-Based MCUs
Renesas Electronics Corporation today announced the expansion of its RA6 Series microcontrollers (MCUs) with 20 new RA6M5 Group MCUs, completing the mainstream line of RA6 Series devices.
Odyssey Semiconductor Technologies, Inc. Raises $5 Million to Further Develop and Commercialize GaN Power Devices for Electric Vehicles and Solar Energy
Odyssey Semiconductor Technologies, Inc. announced it has raised $5 million in a common stock private placement to further fund the development and production of high-voltage vertically-conducting GaN power-switching devices.
KLA Receives Intel’s 2020 Supplier Achievement Award
KLA Corporation announced today it has received the Intel 2020 Supplier Achievement Award (SAA) in Technology.
Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Manufacturing
Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.
3D Design Leads to First Stable and Strong Self-Assembling 1D Nanographene Wires
An international team of researchers has synthesized curved, infinitely stacking nanographenes — like potato chips in a cardboard can — that can assemble into nanowires.
