Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.
Semiconductors
Sequans Opens New R&D Facility in Finland
Sequans Communications S.A. (NYSE: SQNS), leading developer and provider of 5G and 4G solutions for broadband, critical, and massive IoT, announced that it has established a new subsidiary in Salo, Finland, the purpose of which is to support Sequans core development work on 5G and 4G IoT semiconductor solutions. “We established this new R&D center in order to take advantage of the talented community of wireless engineers in Finland who…
Biosensors Monitor Plant Well-Being in Real Time
Researchers at Linköping University, Sweden, have developed biosensors that make it possible to monitor sugar levels in real time deep in the plant tissues – something that has previously been impossible. The information from the sensors may help agriculture to adapt production as the world faces climate change. The results have been published in the scientific journal iScience. The primary source of nutrition for most of the Earth’s population is…
Nanowire Could Provide a Stable, Easy-To-Make Superconducting Transistor
Superconductors — materials that conduct electricity without resistance — are remarkable. They provide a macroscopic glimpse into quantum phenomena, which are usually observable only at the atomic level. Beyond their physical peculiarity, superconductors are also useful. They’re found in medical imaging, quantum computers, and cameras used with telescopes. But superconducting devices can be finicky. Often, they’re expensive to manufacture and prone to err from environmental noise. That could change, thanks…
A Scalable Method for the Large-Area Integration of 2D Materials
Two-dimensional (2D) materials have a huge potential for providing devices with much smaller size and extended functionalities with respect to what can be achieved with today’s silicon technologies. But to exploit this potential we must be able to integrate 2D materials into semiconductor manufacturing lines – a notoriously difficult step. A team of Graphene Flagship researchers in Sweden and Germany now reports a new method to make this work. The…
Wafer-Scale Production of Graphene-Based Photonic Devices
Our world needs reliable telecommunications more than ever before. However, classic devices have limitations in terms of size and cost and, especially, power consumption – which is directly related to greenhouse emissions. Graphene could change this and transform the future of broadband. Now, Graphene Flagship researchers have devised a wafer-scale fabrication technology that, thanks to predetermined graphene single-crystal templates, allows for integration into silicon wafers, enabling automation and paving the…
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems, today announced the appointment of Rob Mains as the organization’s new executive director. Rob has over 35 years of experience in software engineering and development, with 25 years of experience as an EDA software architect focused on microprocessor design and advanced process node technologies. He most recently served as a technology advisor at Spillbox, and…
A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies in Chip-to-Wafer Hybrid Bonding Consortium
A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid Bonding for high density 2.5D and 3D integrated circuit (IC) integration. The newly formed pre-competitive C2W Hybrid Bonding Consortium with international and local industry supply chain companies will leverage IME’s expertise in 2.5D and 3D IC integration and bonding technologies for the development of C2W hybrid bonding process and demonstration of 4 chips stacking with…
UniKLasers Launch World’s First Laser to Operate with 349nm Single Frequency
UniKLasers Limited, a leading manufacturer of high precision scientific laser instrumentation, has launched its new ultra-violet (UV) laser – The Duetto 349 – a single frequency DPSS CW device which emits at 349 nanometres (nm) with a 50 mW output – making it the world’s first laser to operate with single frequency at 349 nm. The Duetto 349 is the latest in a portfolio of laser products that combine the…
USABC Awards $732,448 Battery Technology Assessment Program Contract to Nanoramic Laboratories
The United States Advanced Battery Consortium LLC (USABC), a subsidiary of the United States Council for Automotive Research LLC (USCAR), today announced the award of a $732,448 technology assessment program contract to Nanoramic Laboratories in Boston, Massachusetts to demonstrate Nanoramic’s high energy and power density lithium-ion battery based on polymer binder-free electrode technology in electric vehicle (EV) applications. The contract award, which includes a 50 percent cost share, funds a…
