EVG320 D2W die preparation and activation system provides seamless integration with
third-party die bonders; completes EVG’s equipment portfolio for end-to-end hybrid bonding
for 3D/Heterogeneous Integration
Semiconductors
EV Group Unveils Hybrid Die-to-Wafer Bonding Activation Solution To Speed Up Deployment of 3D Heterogeneous Integration
Atomera Announces Availability of MSTcadfor Modeling Semiconductor Device Improvements with MST
Atomera Incorporated, a semiconductor materials and licensing company focused on deploying its proprietary silicon-proven technology, today announced immediate availability of MSTcadTM, Mears Silicon Technology computer-aided design, a powerful software tool showcasing the advantages of using MST in a variety of semiconductor devices.
Inphi Launches Industry’s First 7nm 50G PAM4 Platform Solution for Hyperscale Data Centers and AI Networks
Inphi Corporation announced its Polaris Gen2 PAM4 platform, the industry’s first 50G, 28Gbaud PAM4 DSP solution based on low-power 7nm CMOS technology.
SEMICON Japan 2020 Virtual Set to Open with Sustainable Industry Growth, Smart Technology in the Spotlight
SEMICON Japan 2020, the largest and most influential gathering of the electronics manufacturing and design supply chain in Japan, opens Friday as a virtual event with sustainable industry growth and the latest industry trends, developments and innovations in focus.
Lattice Launches 2nd Generation Security Solution with New Mach-NX FPGA for Next Generation, Cyber-Resilient Systems
Lattice Semiconductor Corporation, the low power programmable leader, announced the Lattice Mach-NX FPGA family, the second generation in its successful line of secure control FPGAs.
How the 1985 Downturn Set the Silicon Wafer Industry on a Path to Consolidation That Continues Today
By Craig Addison While 2020 will be remembered as annus horribilis for many, it is set to be a record year for dealmaking in the chip industry.
AGC Develops Glass Package for Edge-emitting Laser Diodes
AGC Inc., a Tokyo-based world-leading manufacturer of glass, chemicals and high-tech materials, has announced the development of a glass package that is ideal for encapsulating edge-emitting laser diode (LD) chips.
Erica Graham an AIM Photonics Journey
AIM Photonics, the Department of Defense (DoD) sponsored Integrated Photonics Manufacturing Institute, heads into its fifth year, with a number of notable accomplishments and technological achievements.
Chip Warriors Bonus Videos Available on YouTube, Including Rare Footage of 50th Anniversary Fairchild Planar IC Event with Gordon Moore and Jay Last
Bonus video material not seen in public before has been published on The Chip Warriors’ YouTube channel. The video clips are an adjunct to The Chip Warriors podcast series which celebrates America’s semiconductor pioneers.
New Semiconductor Detector Shows Promise for Medical Diagnostics and Homeland Security
Security officials are tasked with preventing criminals from smuggling dangerous materials into a country, and detecting nuclear substances has been difficult and costly. Now Northwestern University researchers have developed new devices based on a low-cost material to aid in the detection and identification of radioactive isotopes.
