Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.
Semiconductors
3D Design Leads to First Stable and Strong Self-Assembling 1D Nanographene Wires
An international team of researchers has synthesized curved, infinitely stacking nanographenes — like potato chips in a cardboard can — that can assemble into nanowires.
New Supply Chain Model for Silicon Wafers
United Silicon Innovation Corporation of Taipei, Taiwan, Phoenix Silicon International Corp. and CGI Americas have announced a new wraparound solution for semiconductor wafer supply and world class recycling.
Intel Teams with IBM for Advanced Semiconductor R&D
As Intel expands its domestic manufacturing operations, they will conduct new semiconductor research in advanced semiconductor technology working with IBM’s Albany Semiconductor Research Facility.
Axcelis Announces Multiple Shipments of Purion High Energy Systems to Leading CMOS Image Sensor Manufacturers
Axcelis Technologies, Inc. announced today that it has shipped multiple Purion VXE high energy systems to leading CMOS image sensor manufacturers.
MaxLinear Appoints Tsu-Jae King Liu to Its Board of Directors
Dr. Liu has been appointed a Class I director with a term continuing until the 2022 annual meeting of stockholders, effective immediately.
TSMC’s Technology Roadmap
Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Company (TSMC), provided detailed insights into the company’s technology roadmap at the recent International Solid-State Circuits Conference (ISSCC). He waved off the suggestion that device technology improvements are slowing down.
SiFive and DARPA Collaborate to Bring the Power of RISC-V to Technology Innovation
SiFive, Inc., the provider of commercial RISC-V processor IP and custom silicon solutions, today announced an open licensing agreement with the U.S. Defense Advanced Research Projects Agency (DARPA) to accelerate technology innovation as part of the DARPA Toolbox Initiative.
CyberOptics to Share Technical Presentation About Airborne Particle Sensing Processes at PhotoMask Japan
CyberOptics Corporation will present a technical paper at PhotoMask Japan on April 20th at 6 p.m. CDT / April 21st at 8 a.m. JST.
Damage from Fire at Renesas Chip Factory Worse Than Initial Reports
Renesas Electronics Corporation today held a second press conference regarding the occurrence of a fire on March 19, 2021 at part of the processes in the N3 Building (300mm line) of Naka Factory (located in Hitachinaka, Ibaraki Prefecture).
