The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, today sent a letter to President Biden urging him to include substantial funding for semiconductor manufacturing and research in the administration’s economic recovery and infrastructure plan.
Semiconductors
Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54%
Foundries and memory IC suppliers maintain strongest capacity presence.
Kuprion Introduces ActiveCopper Filled Thermal Vias
Kuprion, Inc., a spinout of Lockheed Martin, introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high performance systems.
Sequans Opens New R&D Facility in Finland
Sequans Communications S.A. (NYSE: SQNS), leading developer and provider of 5G and 4G solutions for…
Biosensors Monitor Plant Well-Being in Real Time
Researchers at Linköping University, Sweden, have developed biosensors that make it possible to monitor sugar…
Nanowire Could Provide a Stable, Easy-To-Make Superconducting Transistor
Superconductors — materials that conduct electricity without resistance — are remarkable. They provide a macroscopic…
A Scalable Method for the Large-Area Integration of 2D Materials
Two-dimensional (2D) materials have a huge potential for providing devices with much smaller size and…
Wafer-Scale Production of Graphene-Based Photonic Devices
Our world needs reliable telecommunications more than ever before. However, classic devices have limitations in…
CHIPS Alliance Brings on Rob Mains as New Executive Director
CHIPS Alliance, the leading consortium advancing common and open hardware for interfaces, processors and systems,…
A*STAR’s Institute of Microelectronics Partners Eight Semiconductor Companies in Chip-to-Wafer Hybrid Bonding Consortium
A*STAR’s Institute of Microelectronics (IME) has partnered leading semiconductor companies to develop Chip-to-Wafer (C2W) Hybrid…
