The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program.
Semiconductors
Metrology Solutions for Gate-All-Around Transistors in High Volume Manufacturing
High-speed, non-destructive OCD metrology has the capability needed to support process control throughout the GAA process flow.
The Most Sensitive and Fastest Graphene Microwave Bolometer
Scientists from Harvard, ICFO, MIT, Raytheon BBN Technologies and NIMS construct the fastest and most sensitive graphene-based microwave bolometer achieved so far.
Colloidal Quantum Dot Light Emitters Go Broadband in the Infrared
Broadband light emission in the infrared has proven to be of paramount importance for a large range of applications that include food quality and product/process monitoring, recycling, environmental sensing and monitoring, multispectral imaging in automotive as well as safety and security.
Pioneering Liquid Compression Molding Material from Henkel Advances Fan-In and Fan-Out Wafer-Level Packaging
Henkel Corporation today announced the commercial availability of LOCTITE ECCOBOND LCM 1000AF, a breakthrough encapsulation material that leverages a unique anhydride-free resin platform to enable thorough protection, improved warpage control and fine gap filling for fan-in and fan-out wafer-level packages (FI WLPs, FO WLPs).
Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications
Hprobe, a provider of semiconductor Automated Test Equipment (ATE) for magnetic devices, today announced the first industry turnkey testing equipment dedicated to 3D magnetic sensors used in both automotive and industrial applications.
Silicon Labs Promotes Serena Townsend to Senior Vice President and Chief People Officer
Silicon Labs announced Serena Townsend, formerly vice president of Human Resources, has been promoted to senior vice president and chief people officer.
Metal Wires of Carbon Complete Toolbox for Carbon-Based Computers
Transistors based on carbon rather than silicon could potentially boost computers’ speed and cut their power consumption more than a thousandfold — think of a mobile phone that holds its charge for months — but the set of tools needed to build working carbon circuits has remained incomplete until now.
Fab Models Built on AI Collaborative Knowledge Sharing
New AI knowledge sharing fab models will play a leading role in shaping the fab of the future.
GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities
GLOBALFOUNDRIES announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities.
