Expect mixed effects in the 2020 MEMS market, followed by growth in the longer term.
Semiconductors
SUEZ Unveils New Sievers TOC Analyzers for Online Ultrapure Water Monitoring
SUEZ – Water Technologies & Solutions announced the launch of two new Total Organic Carbon (TOC) online analyzers, the M500 for life sciences and the M500e for microelectronics markets.
CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
In an invited paper at IEDM 2020, CEA-List and CEA-Leti, research institutes at CEA, presented their technologies for achieving exascale-level, high- performance computing (HPC). Highlighting CEA-Leti’s state-of-the-art, 3D-technology toolbox and CEA-List’s advanced demonstrators that together enable higher bandwidth and heterogeneity for processors, the paper explains architectural and performance advances and describes how 3D-integration technologies allow heterogeneity and increased bandwidth that are critical for hardware innovations that help enable exascale computing. …
Combining Forces: LS Laser Systems and EPP Merge to Form L-TRIS
The Photonics Systems Group, a market leader in laser systems for micromaterial processing, is proud to announce the merger of two Group companies, LS Laser Systems and EPP Electronic Production Partners.
Industry Strategy Symposium to Lead Microelectronics Into New Era of Innovation
SEMI announced today that the virtual Industry Strategy Symposium (ISS) 2021 will take place January 12-13 with the theme Bridging the Gap Between the Physical and Digital Worlds.
ClassOne Receives Repeat Order for its Solstice Electroplating System from Major Taiwanese Semiconductor Manufacturer
Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice S8 electroplating system to a major semiconductor foundry service based in Taiwan.
CEA-Leti Papers at IEDM 2020 Highlight Progress in Overcoming Challenges to Making GaN Energy-Saving, Power-Electronics Devices
Two complementary research papers from CEA-Leti confirmed that the institute’s approach to gallium-nitride (GaN) technologies is on track overcome challenges in the architecture and performance of advanced GaN devices embedding a MOS gate, and targeting the fast-growing global market for power-conversion systems.
SUSS MicroTec Opens New Production Facility in Taiwan
The new SUSS location in the state-funded Science Park in Hsinchu, Taiwan consists of an office and production area and an application, demonstration and training center. The expansion is a necessary step as part of the “SUSS 2025” corporate strategy, which envisages a significant increase in sales.
UMBC Team Reveals Possibilities of New One-Atom-Thick Materials
New computational research makes reliable predictions about desirable properties of new 2D materials, saving experimental researchers time and money and foreshadowing ‘tunable’ materials for particular applications.
Aledia, French Developer of Next-Generation MicroLED Displays for High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world’s first microLED chips produced on 300mm (12”) silicon wafers.
