Primarius Technologies today announced that its NanoSpice universal parallel SPICE simulator has been validated and certified for Samsung Foundry’s 3/4nm technology
Semiconductors
ETRI Creates 3D Shapes from a Flat Surface Using LEDs
A team of South Korean researchers has developed a groundbreaking haptic (tactile) display technology that is attracting global attention.
Aidentyx and Lavorro Announce Strategic Collaboration
Semiconductor AI Virtual Assistant leader Lavorro announced today a strategic partnership with Aidentyx – a supplier of AI powered, asset performance management (APM) analytics solutions for smart sub fab, high-technology and industrial manufacturing.
NY CREATES and CEA-Leti Announce Strategic Research Partnership
NY CREATES and CEA-Leti today announced their strategic partnership that will initially focus on the research and co-development of magnetic memory devices, which are used to store computer data.
A New Experimental Approach to Investigate Defects in Semiconductors
At the Laboratory of Condensed Matter for Physics (PMC), a team has successfully determined the spin-dependent electronic structure linked to the presence of defects in the arrangement of atoms in a semiconductor.
CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
CEA-Leti announced the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing semiconductor technologies in Europe.
Silicon Catalyst Ventures Launched to Support Early-stage Semiconductor Startups
Led by a team of seasoned investment and technology experts, in close collaboration with the Silicon Catalyst incubator.
Pearson’s Connections Academy, SEMI Partnership Will Connect Students and Educators to the Semiconductor Industry
Pearson and its Connections Academy, the fully online public school program serving K-12 students, announced today a strategic partnership with the SEMI Foundation, the 501(c)(3) arm of SEMI, a global industry association representing the electronics manufacturing, semiconductor, and design supply chain market.
USTC Integrates Wafer-Scale 2D Materials and Metal Electrodes with van der Waals Contacts
A research team led by Prof. ZENG Hualing, Prof. QIAO Zhenhua, and Prof. SHAO Xiang from the University of Science and Technology of China (USTC) of the Chinese Academy of Sciences (CAS) achieved progress in studying van der Waals (vdW) contacts for two-dimensional (2D) electrical devices.
Breker Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
Breker Verification Systems, whose product portfolio solves challenges across the functional and system verification process for large, complex semiconductors, today unwrapped its RISC-V CoreAssurance and SoCReady SystemVIP providing a complete range of automated tests for the entire RISC-V core and SoC verification stack.
