The new SUSS location in the state-funded Science Park in Hsinchu, Taiwan consists of an office and production area and an application, demonstration and training center. The expansion is a necessary step as part of the “SUSS 2025” corporate strategy, which envisages a significant increase in sales.
Semiconductors
UMBC Team Reveals Possibilities of New One-Atom-Thick Materials
New computational research makes reliable predictions about desirable properties of new 2D materials, saving experimental researchers time and money and foreshadowing ‘tunable’ materials for particular applications.
Aledia, French Developer of Next-Generation MicroLED Displays for High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines
Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world’s first microLED chips produced on 300mm (12”) silicon wafers.
SEMI Technology Unites Global Summit to Spotlight Digital Transformation, Microelectronics Industry Innovation and Growth
Global industry executives from all seven SEMI regions will gather online for the inaugural SEMI Technology Unites Global Summit, February 15-19, 2021, for keynotes on the power of technology to unite the world and insights on how the microelectronics industry can shape the digital future.
Semiconductor Equipment Consensus Forecast – Record Growth Ahead, SEMI Reports
Global sales of semiconductor manufacturing equipment by original equipment manufacturers are projected to increase 16% compared to $59.6 billion in 2019 and register a new industry record of $68.9 billion in 2020.
Foundry Capex to Account for 34% of Total Semi Capex in 2020
7/5nm processes drive foundry capital spending with total semi capex expected to rise 6%.
Hyundai Mobis Acquires Semiconductor Division of Hyundai Autron
Hyundai Mobis announced that the board of directors approved the acquisition of the semiconductor division of Hyundai Autron.
OPENEDGES Signs Semiconductor Design IP License Agreement with Top-Tier Global Semiconductor Company
OPENEDGES Technology, Inc., the world’s leading supplier of AI computing IP solutions, announces semiconductor design IP (intellectual property: design asset) license agreement with a top-tier global semiconductor company.
DENSO Adopts SDK SiC Epi-wafers for Next-Generation Booster Power Modules for FCEVs
Silicon carbide epitaxial wafers (SiC epi-wafers), the main material for power semiconductors, with a diameter of six inches (150mm) and manufactured by Showa Denko K.K., have been adopted by DENSO Corporation for their latest booster power modules for fuel cell electric vehicles (FCEVs).
STMicroelectronics Partners with Schneider Electric on Carbon Neutrality and Co-Development of Energy-Efficient Solutions
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has selected Schneider Electric as a strategic partner to support its goal to reach carbon neutrality by 2027.
