A look inside YMTC’s second-generation 3D-NAND technology, which uses “Xtacking” to bond the peripheral circuitry face-to-face with the memory array instead of alongside.
Semiconductors
Semiconductor Manufacturing Equipment Market is Projected to Reach USD 80 billion by 2026
According to a recent study from market research firm Global Market Insights, The adoption of technologies like AI and IoT in fabrication will significantly impact the semiconductor manufacturing equipment market forecast. Software companies are keen on implementing advanced solutions to cater to the rising demands of compact chipsets and growing production.
Yes, We CAN Preserve Personal Privacy in Voice-First Consumer Devices
A better balance between cloud and edge processing is a better balance between convenience and privacy, and that’s a win for everyone.
VLSI Design Optimization and Validation Process Is Like Painting the Forth Bridge
Some EDA tools have introduced an innovative approach that allows designers to generate design metadata one time for certain verification flows.
Understanding Cooling and Particulate Contamination Challenges for Next Generation ALE Technologies
Mixed-refrigerant Joule-Thomson refrigeration can provide the necessary wafer temperatures and cooling power with smaller footprint, better reliability and lower power consumption than alternative cooling technologies. Cryo-trapping can reduce particle generation by removing the water that mediates the particle formation process.
Continuous and Stable Lasing Achieved from Low-Cost Perovskites at Room Temperature
An international team of researchers led by Kyushu University and Changchun Institute of Applied Chemistry, Chinese Academy of Sciences, has demonstrated stable, continuous lasing at room temperature for over an hour from a class of low-cost materials called perovskites by finally overcoming a phenomenon that has so far prevented such long operation.
Building Patterns From The Bottom: A Complementary Approach to Lithography
With shrinking dimensions, the classical lithography-based top-down patterning processes are becoming extremely complex and expensive. Therefore, researchers worldwide are investigating alternative processes allowing to build patterns from the bottom. Two promising approaches are directed self-assembly (DSA) and area-selective deposition (ASD).
Deep Learning at the Extreme Edge: A Manifesto
With continuous voltage and frequency scaling, the logic is self-timed, adjusting core voltage and clock frequency automatically, ensuring no timing violation. This allows the chip to always run the most efficient way for a given workload.
pSemi Welcomes New Vice President of Sales and Marketing, Vikas Choudhary
pSemi Corporation, a Murata company focused on semiconductor integration, today announces that Vikas Choudhary has joined the company as vice president of sales and marketing. Choudhary will lead pSemi’s worldwide sales, applications engineering, marketing, and marketing communications teams, and he will be responsible for driving pSemi’s unique RF, power, and sensor products into existing and emerging markets.
