Cobham Advanced Electronic Solutions (CAES), a provider of mission critical electronic solutions, announces the appointment of Mike Kahn as Chief Executive Officer (CEO) effective September 1, 2020. Mike takes over from Shawn Black, who is leaving the business to pursue other opportunities.
Semiconductors
MagnaChip Completes Sale of Foundry Services Group and Fab 4
MagnaChip Semiconductor Corporation announced that certain of its wholly owned subsidiaries have completed the previously announced sale of the Company’s Foundry Services Group and the factory in Cheongju to Key Foundry Co., Ltd.
Samsung Begins Mass Production of 16Gb LPDDR5 DRAM at World’s Largest Semiconductor Line
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that its second production line in Pyeongtaek, Korea, has commenced mass production of the industry’s first 16-gigabit (Gb) LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology.
Team’s Flexible Micro LEDs May Reshape Future of Wearable Technology
University of Texas at Dallas researchers and their international colleagues have developed a method to create micro LEDs that can be folded, twisted, cut and stuck to different surfaces.
CMP Consumables US$2.5B in 2020 for IC Fabs
TECHCET announces that the global market for chemical-mechanical planarization (CMP) consumable materials in semiconductor manufacturing is expected to total over US$2.5 billion this year.
Changes to Bosch Rexroth Management in North America
Paul Cooke, President and CEO of Bosch Rexroth North America, based in Charlotte, NC, USA,…
Photonics Researchers Report Breakthrough in Miniaturizing Light-Based Chips
Photonic integrated circuits that use light instead of electricity for computing and signal processing promise greater speed, increased bandwidth, and greater energy efficiency than traditional circuits using electricity.
Olympus and Lavender International Collaborate to Support Advanced NDT Training
Olympus, a leading manufacturer of nondestructive testing (NDT) inspection equipment, has provided its new OmniScan X3 phased array flaw detectors with FMC/TFM to Lavender International’s US facility to support their advanced training courses.
Research Shows Thin-Film Lithium Niobate Photonic Integrated Circuits are Fundamentally Scalable and Highly Cost-Effective, Ideal for Use in Telecommunications and Quantum Computing
Scientists from HyperLight, a leader in the commercialization of lithium niobate (LN) integrated optical circuits, have teamed with Harvard University researchers to achieve a significant technical milestone for photonic integrated circuits (PICs).
Intel Collaborates with Argonne National Laboratory, DOE in Q-NEXT Quantum Computing Research
Intel today announced that it is among the leading U.S. quantum technology companies included in Q-NEXT, one of five new national quantum research centers established by the White House Office of Science and Technology Policy (OSTP) and the U.S. Department of Energy (DOE).
