Bosch has tailored its semiconductor development to the demands of the automotive industry.
Semiconductors
Silicon Industry Veteran Oreste Donzella Joins Sondrel Board as Non-Executive Director
Sondrel, a provider of ultra-complex custom chips, has announced that industry veteran, Oreste Donzella will join its board as a Non-Executive Director (NED) on January 1, 2025.
IBM Brings the Speed of Light to the Generative AI Era with Optics Breakthrough
New co-packaged optics innovation could replace electrical interconnects in data centers to offer significant improvements in speed and energy efficiency for AI and other computing applications.
Jeff Wilson of IBM Wins Si2 Pinnacle Award
Jeff Wilson, a software engineer in the IBM EDA development organization, has been honored with the quarterly Silicon Integration Initiative Pinnacle Award which recognizes volunteers for their professional contributions to Si2 programs.
Semi-damascene Metallization: Inflection Point in Back-end-of-line Processing?
When used in combination with a patternable metal such as Ru, semi-damascene promises to be RC, area, cost and power efficient – offering an interconnect scaling path.
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for the Automotive Industry
ROHM Co., Ltd. today announced that they have entered into a strategic partnership with TSMC on the development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
ACM Research Strengthens Atomic Layer Deposition Portfolio with Qualification of Thermal and Plasma-Enhanced ALD Furnace Tools
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool.
Global Trade Restrictions on Semiconductor Materials Intensify: TECHCET Offers Critical Market Insights
In a series of escalating trade measures, China announced on December 3, 2024, a complete export ban to the U.S. on rare earth materials, including gallium, germanium, antimony, and superhard materials.
CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
The Semiconductor Industry Association applauded the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
