Two implementations showing how engineers can trade off receiver sensitivity for reduced design complexity, component count, and board space in UHF RFID applications.
Semiconductors
Lattice Semiconductor Wins Two Medals at 2020 LEAP Awards
Lattice Semiconductor Corporation, the low power programmable leader, announced that both the Lattice Propel design environment and the Lattice CrossLink-NX FPGA family won medals at the 2020 Leadership in Engineering Achievement Program (LEAP) Awards.
Semiconductor Industry Announces Research and Funding Priorities to Sustain U.S. Leadership in Chip Technology
The Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC) today released a preview of their upcoming “Decadal Plan for Semiconductors,” a report outlining chip research and funding priorities over the next decade that will help strengthen U.S. semiconductor technology and spur growth in emerging technologies such as artificial intelligence, quantum computing, advanced wireless communications.
STMicroelectronics Acquires Power Amplifier and RF Front-End-Module Specialist SOMOS Semiconductor
STMicroelectronics today announced the acquisition and integration of the assets of SOMOS Semiconductor.
Olympus and Hellier NDT Extend Collaboration to Train Future NDT Inspectors
Furthering a partnership that began in 1986, Olympus, a leading manufacturer of nondestructive testing (NDT) solutions, has supplied Hellier’s Houston, Texas location with advanced NDT inspection equipment.
GlobalFoundries Accelerating Innovation in IoT and Wearables with Adaptive Body Bias Features on 22FDX Platform
GLOBALFOUNDRIES (GF) announced today at its Global Technology Conference (GTC) EMEA event that it is accelerating innovation in the IoT and wearables markets with the specialized Adaptive Body Bias (ABB) feature of its industry-leading 22FDX platform.
GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GlobalFoundries 22FDX Solution
GreenWaves Technologies today announced a next-generation hearables platform based on its GAP9 IoT application processor using GLOBALFOUNDRIES (GF) 22FDX solution. The announcement was made at GF’s annual Global Technology Conference (GTC).
Free Membership Offered by the Semiconductor Environmental Safety and Health Association
The Semiconductor Environmental Safety and Health Association (SESHA) is encouraging all semiconductor safety and health professionals to sign up as new members.
Intel Xeon Scalable Platform Built for Most Sensitive Workloads
Intel today unveiled the suite of new security features for the upcoming 3rd generation Intel® Xeon® Scalable platform, code-named “Ice Lake.” Intel is doubling down on its Security First Pledge, bringing its pioneering and proven Intel® Software Guard Extension (Intel® SGX) to the full spectrum of Ice Lake platforms, along with new features that include Intel® Total Memory Encryption (Intel® TME), Intel® Platform Firmware Resilience (Intel® PFR) and new cryptographic accelerators…
A-Pro Semicon Chooses Veeco’s Propel HVM Platform for the Deveopment of GaN Power Seimconductor and 5G RF Devices
Veeco Instruments Inc. announced that A-Pro Semicon, Co., Ltd, a subsidiary of A-Pro’s semiconductor business based in Korea, has selected Veeco’s Propel HVM MOCVD system for the development and production of GaN-based power and 5G RF semiconductor devices.
