Resonac Corporation and Soitec have signed an agreement to develop 200mm (8-inch) SmartSiC silicon carbide (SiC) wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding silicon carbide technology in Japan and other international markets.
Semiconductors
SIA Urges House Passage of Bipartisan Bill to Streamline Environmental Review of CHIPS Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer urging the House of Representatives to pass the Building Chips in America Act (S. 2228).
HyperLight Accelerates Growth With $37M Funding Led by Summit Partners
HyperLight Corporation, a provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners.
Lam Research Honors Global Suppliers with 2024 Excellence Awards
Lam Research Corp. today announced this year’s recipients of its annual Supplier Excellence Awards, recognizing nine companies from around the world for performance across a range of categories.
Global Semiconductor Sales Increase 18.7% Year-to-Year in July
Sales into the Americas jump 40.1% year-to-year to lead all markets; worldwide chip sales increase 2.7% month-to-month.
The MMEC Receives Microelectronics Commons Project Awards
The Midwest Microelectronics Consortium (MMEC) announced the award of five technology development projects through Microelectronics Commons
Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
Synopsys, Inc. today announced it has entered into a definitive agreement for the sale of its Optical Solutions Group (OSG) to Keysight Technologies, Inc., a provider of design, emulation and test solutions.
Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages
Resonac Corporation has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process.
NORDTECH R&D Projects Selected to Receive $30M in Federal Awards from U.S. Department of Defense
These projects are set to receive a total of more than $30 million in the technical areas of quantum and commercial leap ahead technologies.
White House, DOD Officials Award $29.6.M for 5 SWAP Hub Projects
CHIPS Act investment powers collaborative effort to advance US microelectronics manufacturing.
