Silvaco Group, Inc. today announced multiple initiatives to address the industry’s talent shortage and foster development of skills to enable students to pursue careers in the semiconductor field.
Semiconductors
Breakthrough in Next-Generation Memory Technology
A research team led by Professor Jang-Sik Lee from the Department of Materials Science and Engineering and the Department of Semiconductor Engineering at Pohang University of Science and Technology (POSTECH) has significantly enhanced the data storage capacity of ferroelectric memory devices.
SEMI Applauds New Legislative Solution to Address Gap in U.S. CHIPS Act Notice of Funding Opportunity
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, issued the following statement from Joe Stockunas, President of SEMI Americas.
Diraq Achieves Record Accuracy for Quantum Computing Device Manufactured by Existing Semiconductor Infrastructure
99.9% single-qubit fidelity demonstrated on quantum processing device utilizing industry-standard CMOS materials.
Element Six and Orbray Announce Collaboration
Element Six (E6) and Orbray today announced a strategic collaboration to deliver the world’s highest quality wafer-scale single crystal (SC) synthetic diamond.
Heating Gallium Nitride and Magnesium Forms a Superlattice with Implications for Semiconductor Doping and Electronic Devices
A study led by Nagoya University in Japan revealed that a simple thermal reaction of gallium nitride (GaN) with metallic magnesium (Mg) results in the formation of a distinctive superlattice structure.
Fractilia Adds Optical Proximity Correction Metrology to Stochastics HVM Control Solution
Fractilia today introduced FAME OPC, a new product that provides critical optical proximity correction (OPC) measurement and analysis capabilities for improved OPC modeling – an essential technique used in advanced patterning.
Greene Tweed Completes Manufacturing Facility in South Korea
Greene Tweed, a global manufacturer of high-performance thermoplastics, composites, seals, and engineered components, has announced the completion of its new manufacturing facility in Ochang, Cheongju-si, Chungcheongbuk-do, Republic of Korea.
Pfeiffer Vacuum Introduces Dry Chiller Module for Container Closure Integrity Testing (CCIT) at Low Temperatures
Pfeiffer Vacuum introduces an addition to both new and existing leak detection systems: the Dry Chiller Module. Serving as an extended cooling component for ASM 2000 and AMI 1000 leak detectors, this module sets new benchmarks in producing dependable data for testing container closure integrity at low temperatures.
Miniaturizing a Laser on a Photonic Chip
Scientists led by Dr Yang Liu and Professor Tobias Kippenberg at EPFL have built the first ever chip-integrated erbium-doped waveguide laser that approaches the performance with fiber-based lasers, combining wide wavelength tunability with the practicality of chip-scale photonic integration.
