North America-based manufacturers of semiconductor equipment posted $2.37 billion in billings worldwide in February 2020 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.2 percent higher than the final January 2020 level of $2.34 billion, and is 26.2 percent higher than the February 2019 billings level of $1.88 billion.
Semiconductors
COVID-19 To Have Significant Effect on Worldwide Semiconductor Market in 2020, According to IDC
The Coronavirus Disease 2019 (COVID-19) is affecting China and is spreading within East Asia and into Europe and North America. In addition to the human cost of life, the impact of the spread of the virus on the global economy is only beginning to be appreciated and has deep implications for the world’s technology supply chain. A new International Data Corporation (IDC) report, Impact of COVID-19 on the Worldwide Semiconductor Market Forecast (IDC #US46115520), provides IDC’s view on the impact the COVID-19 virus will have on the semiconductor market.
A Nanoscale Laser Made of Gold and Zinc Oxide
Tiny particles composed of metals and semiconductors could serve as light sources in components of future optical computers, as they are able to precisely localize and extremely amplify incident laser light. A team from Germany and Sweden led by Prof. Dr. Christoph Lienau and Dr. Jin-Hui Zhong from the University of Oldenburg has now explained for the first time how this process works. The study is published in the current issue of the journal Nature Communications.
“Black Swan” Event Triggers Revision to 2020 IC Market Forecast
The recent surge of the spread of the coronavirus (Covid-19) and its anticipated negative impact on the global economy and IC market definitely fits the definition of a Black Swan event.
Semiconductors Can Behave Like Metals and Even Like Superconductors
The crystal structure at the surface of semiconductor materials can make them behave like metals and even like superconductors, a joint Swansea/Rostock research team has shown. The discovery potentially opens the door to advances like more energy-efficient electronic devices. Semiconductors are the active parts of transistors, integrated circuits, sensors, and LEDs. These materials, mostly based on silicon, are at the heart of today’s electronics industry.
Novel Approach to Enhance Performance of Graphitic Carbon Nitride
In a report published in NANO, scientists from the Jiangxi University of Science and Technology, Guangdong University of Petrochemical technology, Gannan Medical University and Nanchang Hangkong University in China underline the importance of defect engineering to promote catalytic performance by providing a simple and efficient way for modifying and optimizing metal-free semiconductor photocatalyst graphitic carbon nitride (g-C3N4) to solve the dual problems of environmental pollution and lack of fossil resources.
Ferdinand-Braun-Institut Chooses Solstice S4 for Advanced Electroplating and Wafer Surface Processing
ClassOne Technology, global supplier of advanced electroplating systems for ≤200mm wafer processing, announced the sale of its Solstice® S4 system to the Ferdinand-Braun-Institut (FBH) in Berlin. The FBH is a major III-V compound semiconductor research institute that develops leading-edge microwave and optoelectronic devices for communications, energy, health, mobility and other industries.
New SEMI Job Skills Model for Growing Microelectronics Industry Talent Pipeline Released by U.S. Department of Labor – Employment and Training Administration
SEMI today announced the release of a central feature of its workforce development initiative, designed to grow the microelectronics industry’s talent pipeline, on the U.S. Department of Labor’s Competency Model Clearinghouse website. The Unified Competency Model (UCM) for Advanced Manufacturing identifies skill sets required across strategic industry sectors to strengthen connections among the microelectronics industry, workers, and education and training providers.
Room-temperature Bonded Interface Improves Cooling of Gallium Nitride Devices
A room-temperature bonding technique for integrating wide bandgap materials such as gallium nitride (GaN) with thermally conducting materials such as diamond could boost the cooling effect on GaN devices and facilitate better performance through higher power levels, longer device lifetime, improved reliability, and reduced manufacturing costs.
Finding Wafers Just Got Much Easier
Inseto launches comprehensive online store for selecting and ordering silicon, silica, glass, coated and SOI wafers.
