A critical element to successful IoT security chips is public key infrastructure (PKI). All IoT devices with these chips require a strong identity, which will then be used for secure authentication.
Semiconductors
MISUMI to Relocate North American HQ to Schaumburg Corporate Center
MISUMI, a global supplier of configurable components, is excited to announce the relocation of its North American corporate headquarters to Glenstar’s Schaumburg Corporate Center located at 1475 E. Woodfield Road. Located adjacent to Woodfield Mall, the total property is a 1 million-square-foot, three-building office complex. MISUMI plans to take occupancy in June 2020.
Water-Free Way to Make MXenes Could Mean New Uses for the Promising Nanomaterials
Ten years after producing the first sample of the now widely studied family of nanomaterials, called MXenes, Drexel University researchers have discovered a different way to make the atom-thin material that presents a number of new opportunities for using it. The new discovery removes water from the MXene-making process, which means the materials can be used in applications in which water is a contaminant or hampers performance, such as battery electrodes and next-generation solar cells.
A 300mm Platform for 2D-Material Based MOSFET Devices
2D materials, a family of materials that form two-dimensional crystals, promise to enable a broad range of semiconductor applications, such as selectors or back-end compatible transistors.
Advent of 5G and AI Chip Manufacturing Renews the Need for Advanced Semiconductor Testing Systems
A surge in semiconductor test volumes and stringent test demands from the communication, consumer electronics, automotive and healthcare verticals are expected to revive the semiconductor industry following a sharp decline in revenues for the global semiconductor automated test equipment market in 2019.
EUV Materials Small But Strategic Fraction of $1.6B IC Photoresists Market
The global market for Photoresists and Ancillary Materials declined in 2019 due to semiconductor fabrication market challenges.
Groovy Key to Nanotubes in 2D
Ultrathin carbon nanotubes crystals could have wonderous uses, like converting waste heat into electricity with near-perfect efficiency, and Rice University engineers have taken a big step toward that goal. The latest step continues a story that began in 2013, when Rice’s Junichiro Kono and his students discovered a breakthrough method for making carbon nanotubes line up in thin films on a filter membrane.
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a Virtual Conference
Due to concerns over the global coronavirus (COVID-19) outbreak, the management committee and board of directors of the 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, has decided to hold IRPS 2020 as a virtual conference.
CyberOptics Launches 3D MX3000 Final Vision Inspection (FVI) System for Memory Modules
CyberOptics Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions, launches the Multi-Reflection Suppression (MRS)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D.
Western Digital Announces Appointment of David Goeckeler as Chief Executive Officer
Western Digital Corp. (NASDAQ: WDC) today announced that David Goeckeler has been appointed chief executive officer and a member of the Western Digital Board of Directors (“the Board”), effective March 9, 2020. Mr. Goeckeler currently serves as executive vice president and general manager of Cisco’s $34 billion Networking and Security Business. Mr. Goeckeler succeeds Steve Milligan, who previously announced his intended retirement.
