EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging.
Semiconductors
Unique Material Could Unlock New Functionality in Semiconductors
If new and promising semiconductor materials are to make it into our phones, computers, and other increasingly capable electronics, researchers must obtain greater control over how those materials function. Rensselaer Polytechnic Institute researchers detailed how they designed and synthesized a unique material with controllable capabilities that make it very promising for future electronics.
Picosun Delivers Multiple Production ALD Systems to Asia for Solid State Lighting Device Manufacturing
Picosun Group, Finland-based, global provider of advanced Atomic Layer Deposition (ALD) thin film coating solutions, has been chosen by a major Asian customer to deliver significant ALD production capacity for manufacturing of solid state lighting devices.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes Guideline for Switching Reliability Evaluation Procedures for GaN Devices
JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announces the publication of JEP180: Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices. Developed by JEDEC’s JC-70 Committee for Wide Bandgap Power Electronic Conversion Semiconductors, JEP180 is available for free download from the JEDEC website.
Semiconductor Units To Rebound, Exceed 1 Trillion Devices Again in 2020
Though rising 7%, total semiconductor units forecast to fall short of all-time record.
Advanced Energy Announces Its New Manufacturing Facility in Southeast Asia Is Now Operational
Advanced Energy Industries, Inc. announces that its newest facility in Penang, Malaysia has begun commercial operations and started to deliver products to our customers.
How Low Can You Go? Lower Than Ever Before
Silicon, the best-known semiconductor, is ubiquitous in electronic devices including cellphones, laptops and the electronics in cars. Now, researchers at the National Institute of Standards and Technology (NIST) have made the most sensitive measurements to date of how quickly electric charge moves in silicon, a gauge of its performance as a semiconductor.
Cold Sintering Produces Capacitor Material at Record Low Temperatures
Barium titanate is an important electroceramic material used in trillions of capacitors each year and found in most electronics. Penn State researchers have produced the material at record low temperatures, and the discovery could lead to more energy efficient manufacturing. A team of Penn State scientists used the cold sintering process to densify barium titanate ceramics at less than 572 degrees Fahrenheit (300 degrees Celsius), the lowest processing temperatures ever used, while maintaining the quality achieved at higher temperatures in modern commercial manufacturing, the researchers said.
Micron Partners With Seven Industrial Companies to Deliver Robust and Innovative Solutions
Backed by Micron and other founding members such as Advantech, ATP Electronics, Greenliant, Innodisk, Kontron, Mercury Systems and Viking Technology, Micron’s IQ Partner Program promotes design solutions that deliver high-quality, robust and long-lasting products across a breadth of industrial applications such as factory automation, transportation and defense systems.
KLA Introduces New IC Metrology Systems
Today KLA Corporation (NASDAQ: KLAC) announced the Archer™ 750 imaging-based overlay metrology system and the SpectraShape™ 11k optical critical dimension (“CD”) metrology system for integrated circuit (“IC” or “chip”) manufacturing. As each layer in a chip is constructed, the Archer 750 helps verify that pattern features are correctly aligned to features on previous layers, while the SpectraShape 11k monitors the shapes of three-dimensional structures, such as transistors and memory cells, to ensure they remain in spec.
