Winfried Kaiser, head of Product Strategy of ZEISS Semiconductor Manufacturing Technology (SMT) and, as the highest point of his professional career Fellow of the company, has been honored with the 2020 Frits Zernike Award for Microlithography of the International Society for Optics and Photonics (SPIE). Kaiser received the prize during the SPIE Advanced Lithography Conference in San José, California. The award is considered to be the highest honor in microlithography.
Semiconductors
Imec Demonstrates 24nm Pitch Lines With Single Exposure EUV Lithography on ASML’s NXE:3400B Scanner
This week, at the SPIE Advanced Lithography Conference, imec and ASML announce a breakthrough in printing narrow 24 nanometer (nm) pitch lines, corresponding to the dimensions of critical back-end-of-line metal layers of a 3 nm technology node process.
D2S Extends GPU-Accelerated Wafer Plane Analysis to EUV Photomasks
D2S, a supplier of GPU-accelerated solutions for semiconductor manufacturing, today announced that its TrueMask® WPA (Wafer Plane Analysis) solution — a GPU-accelerated aerial simulation tool that integrates with mask CD-SEM systems to provide fast, highly accurate and highly repeatable CD metrology for complex and curvilinear mask shapes — has been extended for use with EUV photomasks.
Micron joins eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that Micron has joined the eBeam Initiative. As an industry leader in memory and storage solutions, Micron will provide a unique and important perspective to the educational activities of the eBeam Initiative within the semiconductor photomask and lithography supply chain.
Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020
Covering topics from yield management to metrology in the era of artificial intelligence (AI), more than 100 industry experts will deliver 35 hours of technical presentations on the latest advanced semiconductor manufacturing strategies and methodologies at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020), May 4-7, 2020, in Saratoga Springs, New York. Registration is now open.
FLEX and MSTC 2020 Open Today as Flexible Hybrid Electronics Drive Next Wave of Smart MEMS and Sensors
The latest advances in flexible and printed electronics take the spotlight at the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) opening today. FLEX and MSTC 2020 feature keynotes, panels, technical sessions, deep-dive tech talks, networking opportunities and nearly 50 exhibitors with more than 400 attendees. See the full agenda for the four-day events are at the DoubleTree by Hilton Hotel in San Jose, California.
Gigaphoton Unveils New Lasers for 2020
Gigaphoton Inc. (Head Office: Oyama, Tochigi; President & CEO: Katsumi Uranaka), a manufacturer of light sources used in semiconductor lithography, announced on February 21, 2020 that it will add two new models to its ArF and KrF product lineups in 2020. The ArF immersion “GT66A” and the KrF “G60K” light sources will bring the very latest technologies to semiconductor lithography manufacturing.
Samsung Electronics Begins Mass Production at New EUV Manufacturing Line
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, has begun mass production.
CEA-Leti’s Energy-Harvesting ICs Point the Way To Battery-Free Sensor Systems in Humans Or in Harsh Environments
In scientists’ quest for ambient-energy sources that can power sensor nodes in remote environments or difficult-to-reach settings where batteries are impractical, CEA-Leti takes a wide view. It is investigating harvesting systems ranging from micrometer-and-millimeter scale to centimeter scale or larger.
A Spookily Good Sensor
Scientists from the Research Center for Advanced Science and Technology (RCAST) at The University of Tokyo demonstrated a method for coupling a magnetic sphere with a sensor via the strange power of quantum entanglement. They showed that the existence of even a single magnetic excitation in the sphere could be detected with a one-shot measurement. This work represents a major advancement toward quantum systems that can interact with magnetic materials.
