SemiQ (previously Global Power Technologies Group) recently announced the release to production of its new 3rd generation SiC Diode Family featuring blocking voltages of 650V, 1200V and 1700V with forward-current starting at 8 amps up to 50 A per chip. Packages include TO-220-2L, TO-220-3L, TO-247-2L, TO-247-3L, SOT-227, TO-263 as well as bare die.
Semiconductors
SEMI Talent Forum to Help Build Next-Generation Chip Industry Workforce
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea, Edwards, Oxford Instruments, and SPTS Technologies, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.
Technology Trends in Semiconductors, Revealed by GlobalData
Semiconductors will enable the low latency, high bandwidth, pixel-heavy world soon to be spawned by the widespread deployment of 5G, but it will require a series of industry resets involving new architectures, business models, and materials. The central challenge is to process huge volumes of data a lot faster using a much lower power draw per bit stored, processed, and moved.
Semiconductor R&D To Nudge Higher Through 2024
The semiconductor business is defined by rapid technological changes and the need to maintain high levels of investment in research and development for new materials, innovative manufacturing processes for increasingly complex chip designs, and advanced IC packaging technologies.
Source Materials Enable the Evolution of the Ion-Implantation Process
Recent innovations in the field of new implant materials and innovative packaging are presented.
Scaling the BEOL: A Toolbox Filled with New Processes, Boosters and Conductors
Extending interconnects towards the 3nm technology node and beyond requires several innovations. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward.
Harsh New Processes and Materials Pose Challenges for Vacuum Systems
Maximizing the productivity and profitability of the semiconductor manufacturing process requires pump designs that are optimized for the application, especially harsh applications that use condensable or corrosive gases.
Why AIoT is an Essential Element of Continued Technological Innovation
We’re taking a multiplicity of small steps towards a future where AIoT will be deployed widely, in our cars, cities, factories, and stores — and throughout our lives, for the better.
SerDes Designs: Keeping Pace with a Demanding Network Environment
As speed, signal integrity and test boundaries are pushed, cycles of architectural changes and new levels of design innovation for the SerDes chip are only a few of the challenges.
A Gold Butterfly Can Make Its Own Semiconductor Skin
A nanoscale gold butterfly provides a more precise route for growing/synthesizing nanosized semiconductors that can be used in nano-lasers and other applications. Hokkaido University researchers have devised a unique approach for making nanosized semiconductors on a metal surface. The details of the method were reported in the journal Nano Letters and could further research into the fabrication of nanosized light and energy emitters.
