MEMS technology has changed human interaction with electronic devices. Introduced in the 1990s, the first mass-market MEMS devices were used for inkjet printheads and automotive airbag crash sensors. Today, MEMS are ubiquitous, with billions of the tiny devices adding intelligence and interactivity to smartphones, smart speakers, wearables, automobiles, biomedical devices, remote monitoring and event detection systems, and countless other applications. Integrating MEMS with Flexible Hybrid Electronics (FHE) is an important step in the evolution of this miniaturized intelligent sensing technology, paving the way for its use in new classes of flexible, conformal devices.
Semiconductors
Xperi Enters into New Patent and Technology License Agreement with SK hynix
Xperi Corporation (NASDAQ: XPER) (“Xperi”) today announced that it entered into a new patent and technology license agreement with SK hynix, one of the world’s largest semiconductor manufacturers. The agreement includes access to Xperi’s broad portfolio of semiconductor intellectual property (IP) and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory.
Presto Engineering Acquires DELTA Microelectronics Business from FORCE Technology
Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, announced today that it has acquired the DELTA Microelectronics business unit of FORCE Technology, the European leader in ASIC supply chain services. With this acquisition, Presto adds ASIC design to its suite of services for the Industry 4.0, IoT, and autonomous driving market.
Transitioning to a Circular Economy in Semiconductor Manufacturing
A circular economy is a model for economic activity that is restorative and regenerative by design. This contrasts with the conventional linear model – take, make and waste – that has dominated production design since that advent of the industrial revolution.
Pixel LED Headlights: High Definition Technology Enables New Driving Experiences
LEDS serve as the key technology for the attractive styling of headlights and definition of brand signatures.
Onto Innovation Announces Multiple Orders to Support 5G Ramp
Onto Innovation Inc. (NYSE: ONTO) announced that it has received orders totaling 15 systems from two leaders in advanced packaging. Both customers are ramping up to support the ongoing demand for 5G smartphones which drives advanced packages requiring more precise process control solutions.
Dow Introduces First Solventless Silicone Conformal Coating with UV and Moisture Dual Cure
Dow (NYSE: Dow), introduced today at IPC APEX EXPO 2020 new DOWSIL™ CC-8030 UV and Moisture Dual Cure Conformal Coating, the industry’s first solventless silicone conformal coating with an ultraviolet (UV) and moisture dual cure system for high throughputs. This new environmentally responsible silicone technology promotes sustainability, health and safety while reducing processing costs through automated spraying and fast, energy-efficient UV curing.
Designing and Fabricating Fully-Customized Chips
Silicon chip technology has surprising and largely untapped possibilities for product innovation. But reliably fabricating these specialty chips requires a multidisciplinary team and a robust plan.
A New Wave of Fan-Out Packaging Growth
Key players from different business models are fueling new growth.
The History and Future of DRAM Architecture in Different Application Domains: An Analysis
Common trends and bottlenecks in DRAM architecture are identified.
