Arm today announced the appointment of new Board member Young Sohn.
Semiconductors
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program.
NHanced Semiconductors President Robert Patti to Deliver Keynote at IEEE 3DIC Conference in Sendai, Japan
At the upcoming IEEE International 3D Systems Integration Conference (3DIC), NHanced Semiconductors president Robert Patti will deliver a keynote address detailing the critical role of advanced packaging in continuing the progress of Moore’s Law in semiconductor development.
ETRI Succeeds in the Development of a p-type Semiconductor Material to Lead Semiconductor Innovation
A group of Korean researchers have recently succeeded in developing new p-type semiconductor materials and thin-film transistors that will lead the innovation of the semiconductor industry.
Heidelberg Instruments Reports Several Installations of its ULTRA Semiconductor Mask Writer as Global Semiconductor Demand Surges
Heidelberg Instruments, a provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask Writer from photomask production groups across the US and Asia.
Polymatech and ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France
The new venture will focus on producing sapphire ingots and wafers, key materials for advanced semiconductor devices.
What’s in the August/September Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the August/September issue.
Infineon Pioneers World’s First 300mm Power GaN Technology
Infineon Technologies AG today announced that the company has succeeded in developing the world’s first 300mm power gallium nitride (GaN) wafer technology.
Material Export Restrictions Poised to Strain Semiconductors
TECHCET has identified a potential strain on US semiconductor manufacturing capability as Chinese export restrictions on key materials have been announced.
Samtec Orders ClassOne Technology Solstice S8 Single-Wafer System to Process Glass Core Technology Products
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it has received an order from new customer Samtec for a Solstice S8 single-wafer processing system.
