Ten years after producing the first sample of the now widely studied family of nanomaterials, called MXenes, Drexel University researchers have discovered a different way to make the atom-thin material that presents a number of new opportunities for using it. The new discovery removes water from the MXene-making process, which means the materials can be used in applications in which water is a contaminant or hampers performance, such as battery electrodes and next-generation solar cells.
Semiconductors
A 300mm Platform for 2D-Material Based MOSFET Devices
2D materials, a family of materials that form two-dimensional crystals, promise to enable a broad range of semiconductor applications, such as selectors or back-end compatible transistors.
Advent of 5G and AI Chip Manufacturing Renews the Need for Advanced Semiconductor Testing Systems
A surge in semiconductor test volumes and stringent test demands from the communication, consumer electronics, automotive and healthcare verticals are expected to revive the semiconductor industry following a sharp decline in revenues for the global semiconductor automated test equipment market in 2019.
EUV Materials Small But Strategic Fraction of $1.6B IC Photoresists Market
The global market for Photoresists and Ancillary Materials declined in 2019 due to semiconductor fabrication market challenges.
Groovy Key to Nanotubes in 2D
Ultrathin carbon nanotubes crystals could have wonderous uses, like converting waste heat into electricity with near-perfect efficiency, and Rice University engineers have taken a big step toward that goal. The latest step continues a story that began in 2013, when Rice’s Junichiro Kono and his students discovered a breakthrough method for making carbon nanotubes line up in thin films on a filter membrane.
Due to Concerns Over Coronavirus (COVID-19) Outbreak, the 2020 IEEE International Reliability Physics Symposium Will Be Presented Online as a Virtual Conference
Due to concerns over the global coronavirus (COVID-19) outbreak, the management committee and board of directors of the 2020 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, has decided to hold IRPS 2020 as a virtual conference.
CyberOptics Launches 3D MX3000 Final Vision Inspection (FVI) System for Memory Modules
CyberOptics Corporation (NASDAQ: CYBE), a global developer and manufacturer of high-precision 3D sensing technology solutions, launches the Multi-Reflection Suppression (MRS)-enabled 3D MX3000 Final Vision Inspection (FVI) system for memory modules. The launch extends the memory module inspection system portfolio from 2D to 3D.
Western Digital Announces Appointment of David Goeckeler as Chief Executive Officer
Western Digital Corp. (NASDAQ: WDC) today announced that David Goeckeler has been appointed chief executive officer and a member of the Western Digital Board of Directors (“the Board”), effective March 9, 2020. Mr. Goeckeler currently serves as executive vice president and general manager of Cisco’s $34 billion Networking and Security Business. Mr. Goeckeler succeeds Steve Milligan, who previously announced his intended retirement.
The Ink of the Future in Printed Electronics
A research group led by Simone Fabiano at the Laboratory of Organic Electronics, Linköping University, has created an organic material with superb conductivity that doesn’t need to be doped. They have achieved this by mixing two polymers with different properties. In order to increase the conductivity of polymers, and in this way obtain higher efficiency in organic solar cells, light-emitting diodes and other bioelectronic applications, researchers have until now doped the material with various substances.
Inphi Announces Third Generation, Low-Power Porrima PAM4 Platform for Hyperscale Data Center Networks
Inphi Corporation (NYSE: IPHI), a leader in high-speed data movement interconnects, today announced its new Porrima™ Gen3 Single-Lambda PAM4 platform, the third generation of its industry-leading PAM4 platform solution optimized for hyperscale data center networks. The Porrima Gen3 platform reduces the total module power consumption, lowers total cost of ownership and enables a wider range of lasers, enriching the ecosystem with the next generation of innovation.
