BISTel, the leading supplier of engineering automation and manufacturing A.I. applications announced today the semiconductor industry’s first cloud capable, A.I. powered, fault detection and classification system (FDC). The new FDC solution, called Dynamic Fault Detection (DFD) in the cloud, offers chipmakers a more comprehensive method for detecting faults.
Semiconductors
Lam Research Breaks New Ground in Etch Technology and Productivity for Chipmaking Processes
Lam Research Corp. today announced the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation. Lam’s groundbreaking Sense.i platform offers unparalleled system intelligence in a compact, high-density architecture to deliver process performance at the highest productivity, supporting logic and memory device roadmaps through the coming decade.
Global Semiconductor Sales Down Slightly Year-to-Year in January
“The global semiconductor market got off to a solid start in 2020, with the industry nearly posting positive year-to-year sales growth for the first time in more than a year,” said John Neuffer, SIA president and CEO. “Still, the global market faces significant macroeconomic headwinds, including global trade unrest and ongoing concerns about worldwide spread of the coronavirus, which could limit continued market recovery.”
Women in Semiconductors to Highlight Workplace Diversity at ASMC 2020
The vital importance of workplace diversity in growing the global semiconductor industry’s talent pipeline will take center stage as the Women in Semiconductors (WiS) program returns to the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020) on May 4 in Saratoga Springs, New York. Back by popular demand, WiS continues to connect more women in the semiconductor manufacturing industry while driving critical discussions across genders. The WiS program runs in conjunction with ASMC 2020, May 4-7.
Graphene, Perovskites, and Silicon — An Ideal Tandem for Efficient Solar Cells
Graphene Flagship researchers at the University of Rome Tor Vergata, the Italian Institute of Technology (IIT) and its spin-off, Graphene Flagship Associate Member BeDimensional, in cooperation with ENEA have successfully combined graphene with tandem perovskite-silicon solar cells to achieve efficiencies of up to 26.3%. Moreover, they envisioned a new manufacturing method that, thanks to the versatility of graphene, allows to reduce production costs and could lead to the production of large-area solar panels. Graphene-based tandem solar cells almost double the efficiency of pure silicon.
Sensera Signs World-Wide Distribution Agreement with Braemac to Extend Global Reach
Sensera Limited (ASX: SE1, “Sensera”), an Internet of Things (IoT) solution provider, today announced that it has signed a worldwide distribution agreement with Braemac. Braemac’s global footprint and strong presence in the entire Pacific Rim region and especially Australia will further extend Sensera’s market coverage.
MagnaChip Semiconductor Announces CFO Transition
MagnaChip Semiconductor Corporation (“MagnaChip” or the “Company”) (NYSE: MX) today announced that Jonathan Kim, MagnaChip’s Chief Financial Officer, Executive Vice President and Chief Accounting Officer, is stepping down effective March 27, 2020 to pursue an executive opportunity outside of the semiconductor industry.
Keysight Works with Qualcomm Technologies to Accelerate Small Cell Deployment Supported by 5G vRAN Architecture
Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, announced that Qualcomm Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated, is working with the company to accelerate small cell deployment supported by 5G virtualized radio access network (vRAN) architecture.
EV Group Establishes Heterogenous Integration Competence Center
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging.
Unique Material Could Unlock New Functionality in Semiconductors
If new and promising semiconductor materials are to make it into our phones, computers, and other increasingly capable electronics, researchers must obtain greater control over how those materials function. Rensselaer Polytechnic Institute researchers detailed how they designed and synthesized a unique material with controllable capabilities that make it very promising for future electronics.
