JEDEC Solid State Technology Association today announced the publication of JEP200: Test Methods for Switching Energy Loss Associated with Output Capacitance Hysteresis in Semiconductor Power Devices.
Semiconductors
NXP Combines Ultra-Wideband Secure Ranging and Short-Range Radar to Enable Autonomous Industrial and IoT Applications
NXP Semiconductors N.V. today announced the Trimension SR250, the industry’s first single-chip solution that integrates on-chip processing capabilities with both short-range UWB radar and secure ranging.
Intel Names New Representative to Si2 Board
Intel has a new representative on the Silicon Integration Initiative board of directors.
Electrically Modulated Light Antenna Points the Way to Faster Computer Chips
Today’s computers reach their physical limits when it comes to speed. Semiconductor components usually operate at a maximum usable frequency of a few gigahertz – which corresponds to several billion computing operations per second.
Paul V. Walsh, Jr. Joins Kopin Corporation Board of Directors
Kopin Corporation today announced that Paul V. Walsh, Jr. has joined Kopin Corporation’s Board of Directors.
GlobalFoundries and Silicon Catalyst Partner to Accelerate Differentiated Technology Solutions for Semiconductor Startups
GlobalFoundries and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP).
Brooks Instrument Celebrates New Manufacturing Site in Malaysia
Grand opening for the company’s fourth manufacturing facility highlights production and partnership opportunities with key customers in the Asia-Pacific region.
Entegris Appoints Mary Puma to Board of Directors
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced the appointment of Mary Puma to its board of directors.
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
