Important step for practical application of advanced material.
Semiconductors
300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023
300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to the SEMI Industry Research and Statistics group in its first edition of the 300mm Fab Outlook report.
Intel Lays Cornerstone for Mobileye’s New Global Development Center in Jerusalem
Mobileye President and CEO Prof. Amnon Shashua and Israeli Prime Minister Benjamin Netanyahu laid the cornerstone for Mobileye’s new global development center in Jerusalem on Tuesday, Aug. 27, 2019.
Toshiba Memory to Acquire the SSD Business of Taiwan’s LITE-ON Technology
Toshiba Memory Holdings Corporation, which will rebrand as Kioxia Holdings Corporation on October 1, 2019, announced today that it has signed a definitive agreement with LITE-ON Technology Corporation to acquire its Solid State Drive (SSD) business.
Intel Updates Advanced Packaging Technologies at Semicon West, the Latest in a Decade (or more) Evolution
In the last several years, Intel has had a series of announcements in the packaging arena, focused on the integration of multiple styles of chips in the same package to improve performance and broaden system capabilities.
Superior Process Quality With Picosun’s new R&D PEALD Technology
Picosun Group, a supplier of AGILE ALD (Atomic Layer Deposition) thin film coating solutions, reports excellent results obtained with its next generation R&D PEALD (plasma-enhanced ALD) technology.
Theory Reveals the Nature of Crystals Defects (of Silicon Carbide)
Imperfections of crystal structure, especially edge dislocations of an elongated nature, deeply modify basic properties of the entire material and, in consequence, drastically limit its applications. Using silicon carbide as an example, physicists from Cracow and Warsaw have shown that even such computationally demanding defects can be successfully examined with atomic accuracy by means of a cleverly constructed, small in size, model.
Enhancing Materials for Hi-Res Patterning to Advance Microelectronics
Scientists at Brookhaven Lab’s Center for Functional Nanomaterials created ‘hybrid’ organic-inorganic materials for transferring ultrasmall, high-aspect-ratio features into silicon for next-generation electronic devices.
EV Group and Schott Partner to Demonstrate Readiness of 300mm Nanoimprint Lithography for High-Volume Augmented/Mixed Reality Glass Manufacturing
Joint work to be carried out at EVG’s NILPhotonics Competence Center, an open innovation incubator for nanoimprint lithography (NIL) and the only accessible 300mm NIL development line worldwide.
KLA Joins Automotive Electronics Council
KLA Corporation announced today that the Automotive Electronics Council (AEC), the organization that sets qualification standards for electronic components in the automotive industry, has accepted the company as an associate member.
