Patent covers method for fabrication of diamond semiconductor materials.
Semiconductors
Trymax Receives Order from a Leading-Edge Photonics Research Organization
Eindhoven University of Technology (TU/e) acquires a plasma solution from Trymax.
2019 IEEE International Electron Devices Meeting to Highlight Innovative Devices for an Era of Connected Intelligence
The upcoming 65th annual IEEE International Electron Devices Meeting (IEDM), to be held December 7-11, 2019 at the Hilton San Francisco Union Square hotel, will once again feature the latest and most important research taking place in semiconductors and other electron devices, but with a sharper focus this year on devices intended to support diverse new applications.
SIA Statement Following Commerce’s Announcement to Extend the Temporary General License
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today released the following statement from SIA President & CEO John Neuffer following the Department of Commerce announcement adding Huawei affiliates to the entities list and providing an extension of the Temporary General License until November 2019.
Creating Customer Value: A Case Study on 300mm Manufacturing Learning for Back Qualification of 200mm Processing
The cost of many 300mm chemical Mechanical Planarization (CMP) consumables has decreased in recent years due to a maturing market and new process learning, making it economically feasible to embark on a new 200mm Oxide CMP polishing process based on these advanced commercial consumables in the market, today.
Cerebras Systems Unveils the Industry’s First Trillion Transistor Chip
Cerebras Systems, a startup dedicated to accelerating Artificial intelligence (AI) compute, today unveiled the largest chip ever built. Optimized for AI work, the Cerebras Wafer Scale Engine (WSE) is a single chip that contains more than 1.2 trillion transistors and is 46,225 square millimeters.
Researchers Demonstrate Three-Dimensional Quantum Hall Effect For the First Time
The three-dimensional quantum Hall effect was predicted more than 30 years ago, but has not been observed until now by the Singapore University of Technology and Design together with international researchers.
X-ray and Ultrasound Pinpoint Structural Defects in Microelectronic Components
Internal structural anomalies have nowhere to hide when
X-ray and ultrasound are used in combination.
Optofluidic Chip with Nanopore ‘Smart Gate’ Developed For Single Molecule Analysis
Programmable device enables on-demand delivery of individual biomolecules with feedback-controlled gating for high-throughput analysis.
4th CMC Seminar Focus on Materials Quality
Quality excursions can cost fabs hundreds of millions of dollars.
