A partnership that began in 2017 between Navajo Technical University (NTU) and the U.S. National Science Foundation Materials Research Science and Engineering Center at Harvard University is providing Navajo students with new opportunities to pursue advanced degrees in science and engineering while helping to address critical issues facing the Navajo Nation.
Semiconductors
Advanced Chip Process Development Grows ALD/CVD Materials
TECHCET is forecasting the Semiconductor Precursor Materials Market to rebound by 15% in 2024, reaching $1.7 billion.
NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries
NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced packaging facility in Morrisville, NC.
Researchers Create Materials With Unique Combo of Stiffness, Thermal Insulation
Researchers have demonstrated the ability to engineer materials that are both stiff and capable of insulating against heat. This combination of properties is extremely unusual and holds promise for a range of applications, such as the development of new thermal insulation coatings for electronic devices.
Axus Technology Secures $12.5 Million in Capital Funding
Axus Technology, a provider of chemical mechanical planarization (CMP) equipment, critical for manufacturing semiconductors and compound semiconductors, today announced it has received $12.5 million in capital funding from growth capital firm IntrinSiC Investment LLC.
SEMICON Southeast Asia 2024 Opens Today
Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 opens today at MITEC in Kuala Lumpur with visionaries and experts gathered for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development.
New Survey to Access Job Skills Needs in Europe’s Microelectronics Industry
SEMI invites key industry stakeholders to participate in a survey designed to access job skills in highest demand in Europe’s microelectronics industry in 2024.
IEEE International Electron Devices Meeting (IEDM) Announces 2024 Call for Papers
Under the theme “Shaping Tomorrow’s Semiconductor Technology,” the 70th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.
EV Group Doubles Throughput of Semiconductor Layer Transfer Tech with EVG LayerRelease System
Dedicated HVM equipment platform boosts productivity and lowers cost-of-ownership of novel infrared laser release technology through silicon carrier wafers for 3D integration applications.
NY CREATES and Raytheon Unveil Collaborative Semiconductor Workforce Training Initiative
The New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), in collaboration with Raytheon, an RTX business, announced the deployment of the NY CREATES/Raytheon Workforce Training Program.
