Scientists at the National Renewable Energy Laboratory (NREL) achieved a technological breakthrough for solar cells previously thought impossible. The scientists successfully integrated an aluminum source into their hydride vapor phase epitaxy (HVPE) reactor, then demonstrated the growth of the semiconductors aluminum indium phosphide (AlInP) and aluminum gallium indium phosphide (AlGaInP) for the first time by this technique.
Semiconductors
Renesas Electronics Collaborates with Xilinx on Versal ACAP Reference Designs
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its power solutions, as well as timing solutions from IDT, a wholly-owned subsidiary of Renesas, support the Xilinx Versal adaptive compute acceleration platform (ACAP) devices featured on the Xilinx VCK190 evaluation kit and the Renesas VERSALDEMO1Z power reference board. Built on 7nm process technology, Versal is the industry’s first ACAP platform that addresses the needs of a wide range of applications in data center, automotive, 5G wireless, and wired and defense markets.
Creating a Nanoscale On-Off Switch For Heat
Polymers are used to develop various materials, such as plastics, nylons, and rubbers. In their most basic form, they are made up of many of identical molecules joined together over and over, like a chain. If you engineer molecules to join together in specific ways, you can control the characteristics of the resulting polymer. Using this method, Sheng Shen, an associate professor of mechanical engineering at Carnegie Mellon University, and his research team created a polymer thermal regulator that can quickly transform from a conductor to an insulator, and back again. When it’s a conductor, heat transfers quickly. When it’s an insulator, heat transfer much more slowly. By switching between the two states, the thermal regulator can control its own temperature, as well as the temperature of its surroundings, such as a refrigerator or computer.
New Heat Model May Help Electronic Devices Last Longer
A University of Illinois-based team of engineers has found that the model currently used to predict heat loss in a common semiconductor material does not apply in all situations. By testing the thermal properties of gallium nitride semiconductors fabricated using four popular methods, the team discovered that some techniques produce materials that perform better than others. This new understanding can help chip manufacturers find ways to better diffuse the heat that leads to device damage and decreased device lifespans.
SIA Welcomes ‘Phase One’ U.S.-China Trade Deal
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, released the following statement from SIA president & CEO John Neuffer regarding the “phase one” U.S.-China trade deal announced today.
David J. Kenyon appointed CEO and Patrick Sullivan to CTO for Elevate Semiconductor
Elevate Semiconductor, announced that its Board of Directors has appointed David J. Kenyon as Chief Executive Officer and member of the Board of Directors. Kenyon previously held the position of Vice President of Sales and Marketing for Elevate. The board of directors also appointed Patrick Sullivan to CTO. Patrick previously held the post of CEO.
City College Leads New Photonics Breakthrough
A new approach to trapping light in artificial photonic materials by a City College of New York-led team could lead to a tremendous boost in the transfer speed of data online. Research into topological photonic metamaterials headed by City College physicist Alexander B. Khanikaev reveals that long-range interactions in the metamaterial changes the common behavior of light waves forcing them to localize in space. Further, the study shows that by controlling the degree of such interactions one can switch between trapped and extended (propagating) character of optical waves.
Global Fab Equipment Spending Rebounds in Second Half of 2019 with Stronger 2020 Projected
Projected 2019 global fab equipment spending has been revised upward to US$56.6 billion on the strength of surging memory investments in the latter part of the year after a weak first half, SEMI reported today in its World Fab Forecast. SEMI data now point to just a 7 percent decline in fab equipment investments from 2018 to 2019, a marked improvement on the previously forecast drop of 18 percent. Rising investments in memory – particularly 3D NAND – leading-edge logic and foundries have powered the turnaround.
MIRISE Technologies to be Launched to Develop Semiconductors in Effort to Achieve Safe and Comfortable Future Global Mobility Society
DENSO Corporation and Toyota Motor Corporation today announced that they have named the joint venture to be established in April 2020 MIRISE Technologies (“MIRISE”). The joint venture will conduct research and advanced development of next-generation in-vehicle semiconductors. MIRISE is an acronym for Mobility Innovative Research Institute for SEmiconductors. It also conveys “mirai” (a Japanese word for “future”) and “rise.” Yoshifumi Kato has been appointed President and Representative Director of the new company.
Industry Veteran Dr. Randy Allen Joins SiFive as Vice President of RISC-V Software
SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, today announced that Dr. Randy Allen has joined the company as vice president of RISC-V software. Dr. Allen will be responsible for developing and implementing RISC-V software strategy for SiFive. Dr. Allen brings more than 30 years of industry experience and, most recently, served as vice president of software engineering at Wave Computing. He has also served in leadership roles at tech companies such as Mentor Graphics, National Instruments and Cypress Semiconductor.
