As a world’s leading photonics event, the coming CIOE will present the most completed semiconductor solutions on manufacturing from materials, to devices and applications.
Semiconductors
Worldwide PC Shipments Grew 1.5 Percent in Second Quarter of 2019
After two quarters of decline, the worldwide PC market grew 1.5% in the second quarter of 2019, according to preliminary results by Gartner, Inc. Shipments totaled 63 million units in the second quarter of 2019, up from 62 million units in the second quarter of 2018.
Study Contributes to the Production of Flexible Electronic Devices
Research conducted by Brazilian and Italian scientists ordered the structure of polythiophene to enhance the optical and electronic properties of this organic conductive polymer.
Physicists’ Finding Could Revolutionize Information Transmission
A research team led by physicists at the University of California, Riverside, has observed, characterized, and controlled dark trions in a semiconductor — ultraclean single-layer tungsten diselenide (WSe2) — a feat that could increase the capacity and alter the form of information transmission.
How to Catch More “Disappearing” Latent Defects
By 2020 electronic devices will account for over 35% of the manufacturing cost of an automobile, and by 2030, that number is expected to rise to 50%.
1,000th SEMI Industry Standard Marks 40+ Years of Microelectronics Innovation
SEMI reaches milestone with publication of energetic materials safety guideline.
Standards Industry Leaders Honored at SEMICON West 2019
SEMI yesterday honored five industry leaders at SEMICON West 2019 for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards 1000th Standard Celebration.
CEA-Leti and UnitySC Announce Further Collaboration
Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced a four-year extension of their collaboration to further advance metrology-inspection capabilities per tool, while reducing the tools’ footprint and cost of ownership.
How “Guardbanding” of Inline Wafer Defects Can Improve Chip Reliability Insurance
The semiconductor industry has long used a process known as digital guardbanding to ink-off suspect die.
Maximizing EUVL System Availability
The innovative process of extreme ultraviolet lithography, known in its short form as EUVL or EUV, is the next generation lithography technology that leading semiconductor chip-makers plan to use in the manufacturing of the most advanced semiconductor components.
