Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.
Semiconductors
Plasma-Therm Announces Cooperation with Everspin Technologies Inc.
Everspin Technologies, Inc. has entered into an agreement with Plasma-Therm, allowing Everspin to use the 8-inch Pinnacle Ion Beam Etch System for advanced STT-MRAM materials and etch development in conjunction with their Chandler 8-inch facility.
Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022
Total wafer shipments in 2019 are expected to decline 6 percent from last year’s historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI’s recent semiconductor industry annual silicon shipment forecast. Forecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million square inches in 2019, 11,977 million square inches in 2020, 12,390 million square inches in…
CCNY Physicists Score Double Hit in LED Research
In two breakthroughs in the realm of photonics, City College of New York graduate researchers are reporting the successful demonstration of an LED (light-emitting diode) based on half-light half-matter quasiparticles in atomically thin materials. This is also the first successful test of an electrically driven light emitter using atomically thin semiconductors embedded in a light trapping structure (optical cavity).
Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
Synopsys, Inc. (Nasdaq: SNPS) today announced it has achieved certification for dozens of new, innovative features to the Synopsys Digital and Custom Design Platforms on TSMC’s most advanced 5nm process technology, required for high-performance computing (HPC) and mobile chip designs. In addition to certification of HPC and mobile design flows, Synopsys has also achieved the certification for its design tools on TSMC’s industry-leading N5P and N6 process technologies, enabling early customer design work.
Renesas Electronics and StradVision Collaborate on Smart Camera Development for Next-Generation ADAS
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and StradVision, Inc., a vision processing technology solutions provider for autonomous vehicles with expertise in deep learning, today announced the joint development of a deep learning-based object recognition solution for smart cameras used in next-generation advanced driver assistance system (ADAS) applications and cameras for ADAS Level 2 and above.
Lam Research Announces New Technology Center in Gyeonggi-do, South Korea
Korean government officials from the Gyeonggi-do province and executives at Lam Research Corporation (Nasdaq: LRCX), a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, both signed a memo of understanding (MOU) to establish the Korea Technology Center (KTC), a research and development facility with a focus on key equipment for semiconductor manufacturing processes.
Light In a New Light
In a paper published today in Nature’s NPJ Quantum Information, Omar Magaña-Loaiza, assistant professor in the Louisiana State University (LSU) Department of Physics & Astronomy, and his team of researchers describe a noteworthy step forward in the quantum manipulation and control of light, which has far-reaching quantum technology applications in imaging, simulation, metrology, computation, communication, and cryptography, among other areas. The paper, titled “Multiphoton quantum-state engineering using conditional measurements,” includes co-authors…
Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
Synopsys, Inc. today announced a collaboration with TSMC to develop a broad portfolio of DesignWare interface IP, logic libraries, embedded memories, and one-time programmable (OTP) non-volatile memory (NVM) IP on TSMC’s 5-nanometer (nm) FinFET Plus (N5P) Process. This collaboration reinforces the longstanding relationship between the two companies to provide designers with the high-quality IP needed to lower risk, differentiate their system-on-chips (SoCs), and accelerate their time-to-market.
A Deep Dive into AI Chip Arithmetic Engines
Tesla’s autopilot chip executes 72-trillion additions and multiplications per second: It better get the math right
