Entegris, Inc. announced today it has acquired Hangzhou Anow Microfiltration Co., Ltd., a filtration company for diverse industries including semiconductor, pharmaceutical, and medical. Headquartered in the Xindeng New District, Fuyang National Economic and Technological Development Zone, Hangzhou, Anow is now part of the Microcontamination Control Division of Entegris. The addition of Anow not only brings new polymeric membrane technologies and liquid filtration offerings to Entegris’ global portfolio, but also provides Entegris with additional infrastructure to manufacture filtration products in the Asia region.
Semiconductors
Scientists Create Fully Electronic 2-Dimensional Spin Transistors
Physicists from the University of Groningen constructed a two-dimensional spin transistor, in which spin currents were generated by an electric current through graphene.
SEMICON Taiwan 2019 Opens with Smart Tech, Innovation, Digital Future in Spotlight
With Taiwan expected to lead the world in semiconductor equipment investments in 2019, SEMICON Taiwan 2019 opens today, gathering the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data. September 18-20 at Nangang Exhibition Center, Hall I, in Taipei, SEMICON Taiwan 2019 spans the entire semiconductor and microelectronics supply chain – from design through systems.
Building Stronger, Better Designs with DTCO CMP Modeling and Simulation
Predicting CMP damage has always been a part of the manufacturing process, but in a Design-technology co-optimization (DTCO) flow, foundries and EDA companies can work together to automate CMP model building and simulation.
D2S Enables “Stitchless” Full-Chip Inverse Lithography Technology in a Single Day for The Multi-Beam Era
D2S today introduced TrueMask® ILT, a GPU-accelerated hardware and software system that enables IC manufacturers to implement stitchless, full-chip inverse lithography technology (ILT) for advanced-node designs in a single day.
Light and Sound In Silicon Chips: The Slower The Better
Integrated circuits in silicon enable our digital era. The capabilities of electronic circuits have been extended even further with the introduction of photonics: components for the generation, guiding and detection of light. Together, electronics and photonics support entire systems for data communication and processing, all on a chip. However, there are certain things that even electrical and optical signals can’t do simply because they move too fast.
Paramagnetic Spins Take Electrons for a Ride, Produce Electricity From Heat
An international team of researchers has observed that local thermal perturbations of spins in a solid can convert heat to energy even in a paramagnetic material – where spins weren’t thought to correlate long enough to do so. The research team includes scientists from North Carolina State University, the Department of Energy’s Oak Ridge National Laboratory (ORNL), the Chinese Academy of Sciences and the Ohio State University.
Semiconductor Industry Veteran Bee Bee Ng New SEMI Southeast Asia President
SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that semiconductor industry veteran Bee Bee Ng has joined SEMI as president of SEMI Southeast Asia, reporting to SEMI CFO Richard Salsman. Based in Singapore, Ng will direct SEMI Southeast Asia sales and services; expositions and programs including standards, EHS, workforce development and advocacy; and administrative operations.
Innovative Approaches to Vacuum Enable High-Volume Atomic Layer Processing
Processes such as atomic layer deposition and etch require fast, repetitive, complete exchange of gases in the process chamber. Vacuum equipment manufacturers have responded with solutions that address the challenges presented by these high flow applications.
Examining Chip Manufacturing Challenges for Advanced Logic Architecture
A look at the critical issues that will have to be addressed to cost-effectively produce the next generation of faster, denser chips.
